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080HN H11L2X LT026PS ML40126N 30C45 ADFC32 N4740 IRF9Z24N
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  methods. Datasheet PDF File

For methods. Found Datasheets File :: 29254    Search Time::1.671ms    
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    ECLIPTEK CORP
Part No. EH1100ETTS-1.503M
OCR Text ...e (t) recommended solder reflow methods eh1100etts-1.503m high temperature solder bath (wave solder) ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature...
Description OSCILLATORS 100PPM -40 85 5.0V 4 1.503MHZ TS CMOS FULL 14PIN DIP

File Size 146.47K  /  7 Page

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    NOVACAP
Part No. 0805Y104XXX 0805Z104XXX 1206X104XXX 1206Z104 1206Z104M250NXTM 1206Z104XXX 1206N272XXX
OCR Text ...o chip selection and attachment methods. For more details on MLC products, please refer to the NOVACAP Technical Brochure, available on the NOVACAP website. The Technical Brochure describes capacitor applications, the nature of capacitance,...
Description CERAMIC MULTILAYER CAPACITORS

File Size 2,558.58K  /  52 Page

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    Xilinx
Part No. XQ4000E
OCR Text ...meters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are representative values where one g...
Description QML High-Reliability FPGAs

File Size 311.01K  /  36 Page

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    LBW5SN-FZHX-25 LDW5SN-3T4U-35 LTW5SN-JYKZ-25 LBW5SN-GZJX-35 LDW5SN-1T2U-35

OSRAM GmbH
http://
Part No. LBW5SN-FZHX-25 LDW5SN-3T4U-35 LTW5SN-JYKZ-25 LBW5SN-GZJX-35 LDW5SN-1T2U-35
OCR Text ...ength, radiant power * assembly methods: suitable for all SMT assembly methods * soldering methods: IR reflow soldering * preconditioning: acc. to JEDEC Level 2 * taping: 24-mm tape with 800/reel, o180 mm * ESD-withstand voltage: up to 2 kV...
Description Platinum DRAGON? Lead (Pb) Free Product - RoHS Compliant

File Size 310.25K  /  20 Page

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    Everlight Electronics Co., Ltd.
Infineon
Part No. LPC870-G2J1-1 LOC870-J2L1-1 LSC870-J2L1-1 LYC870-J2L1-1 LGC870-J2K2-1 LOC870-H2J2-1 LSC870-H2J2-1 LYC870-H2J2-1 LPC870-F2G2-1 LGC870-K2M1-1
OCR Text ...: luminous intensity * assembly methods: suitable for all SMT assembly methods * soldering methods: IR reflow soldering * preconditioning: acc. to JEDEC Level 2 * taping: 12-mm tape with 2500/reel, o180 mm or 10000/reel, o330 mm 2001-02-...
Description SINGLE COLOR LED, YELLOW SMT, 2 PIN
Mini SIDELED, green, colorless clear
Mini SIDELED, yellow, colorless clear
Mini SIDELED, super-red, colorless clear
Mini SIDELED, orange, colorless clear
Mini SIDELED, pure green, colorless c...

File Size 111.40K  /  12 Page

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    GIGABYTE
Part No. GA-8S650GXM 8S650GXM
OCR Text ...irective o EN 55011 Limits and methods of measurement of radio disturbance characteristics of industrial,scientific and medical (ISM high frequency equipment Limits and methods of measurement of radio disturbance characteristics of broadca...
Description Motherboard Manual

File Size 4,815.89K  /  104 Page

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    Osram Opto Semiconductors
Part No. LOM67K
OCR Text ...tensity, wavelength  assembly methods: suitable for all smt assembly methods  soldering methods: ir reflow soldering and ttw soldering  preconditioning: acc. to jedec level 2  taping: 8-mm tape with 3000/reel, ? 180 mm or 12000...
Description Hyper Mini TOPLED

File Size 178.53K  /  14 Page

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