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  GS8662T18GE-267 Datasheet PDF File

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Part No. 112 177 267 330
Description Interface IC
Evaluation Kit for the MAX2385, MAX2386

File Size 238.68K  /  2 Page

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HUA FENG CIRCUIT





    Winchester Electronics Corporation
Part No. SDKA-59-267
Description PLUG, TNC

File Size 54.19K  /  1 Page

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    METHODE ELECTRONICS INC
Part No. BA-2675-209
Description 9 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER

File Size 217.81K  /  2 Page

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    http://
Part No. 571-4267
Description Insulated solder terminal, Slotted, Feed thru

File Size 27.83K  /  1 Page

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    5267-06A

Molex Electronics Ltd.
Part No. 5267-06A
Description    2.50mm Pitch SPOX?Wire-to-Board Header, Vertical, Shrouded, 6 Circuits, Tin (Sn) Plating

File Size 28.16K  /  2 Page

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    5267-08A

Molex Electronics Ltd.
Part No. 5267-08A
Description    2.50mm Pitch SPOX?Wire-to-Board Header, Vertical, Shrouded, 8 Circuits, Tin (Sn) Plating

File Size 28.13K  /  2 Page

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    GEL-2670

Level One
Part No. GEL-2670
Description 26-Port L2 Managed Gigabit Ethernet Switch, 2 x SFP

File Size 408.14K  /  5 Page

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    GEL-2671

Level One
Part No. GEL-2671
Description 26-Port L2 Managed Gigabit Ethernet Switch, 4 x SFP/RJ45 Combo, 2 x SFP

File Size 426.51K  /  5 Page

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    5267-03A

Molex Electronics Ltd.
Part No. 5267-03A
Description    2.50mm Pitch SPOX?Wire-to-Board Header, Vertical, Shrouded, 3 Circuits, Tin (Sn) Plating

File Size 28.16K  /  2 Page

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    5267-05A

Molex Electronics Ltd.
Part No. 5267-05A
Description    2.50mm Pitch SPOX?Wire-to-Board Header, Vertical, Shrouded, 5 Circuits, Tin (Sn) Plating

File Size 28.16K  /  2 Page

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