die wafer pdf Datasheet P3 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : INT100 4762A ICS8705I EM9010 0ETTS SA110 UPC4570C UPD78C14
	Product Description
	Full Text Search

die wafer Datasheet PDF File

For die wafer Found Datasheets File :: 4533 Search Time::2.703ms
Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				STMicroelectronics
Part No.	TN1181
OCR Text	...st proposes for most products (die - package combinations) an en gineering model (em) qua lity level, primarily intended to support develo...wafer sort (ews). ? are submitted to the same wafer lot qualification test s, but without radiation...
Description	Engineering Model quality level
File Size	132.17K / 5 Page	View it Online	Download Datasheet

				NXP
Part No.	SL2ICS2001V1D
OCR Text	... code sl2ics2001dw/v1d - bumped die on sawn wafer on uv-tape 9352 795 61005 150030 ? nxp b.v. 2008. all rights reserved. product data sheet addendum rev. 3.0 ? 5 february 2008 2 of 9 nxp semiconductors sl2ics2001dw/v1d i-code sli label...
Description	I-CODE SLI Label IC bumped wafer specification on UV-tape
File Size	198.40K / 9 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PCF8564ACX9
OCR Text	...cription version pcf8564au bare die wire bond die; 9 bonding pads pcf8564au pcf8564aug bare die 9 bumps pcf8564aug table 2. ordering option...wafer, sawn, on ffc pcf8564au/5bb/1 935289319015 pcf8564au/5bb/1,01 1 unsawn wafer pcf8564au/5gb/1 9...
Description	Real time clock and calendar
File Size	417.38K / 48 Page	View it Online	Download Datasheet

				Infineon Technologies A...
Part No.	IGC89T170S8RM
OCR Text	...? chip type v ce i c die size package igc89 t1 7 0 s8rm 17 00v 7 5a 8 . 85 x 1 0 . 09 mm 2 sawn on foil m...wafer size 200 mm max.possi ble chips per wafer 280 passivation frontside photoimide ...
Description	low switching losses
File Size	162.85K / 5 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	AN886
OCR Text	...ionality is present in both the die and the as- sembled product. this functionality can be fully evaluated at both wafer probing and final electrical test , thus ensuring a low reject rate at customer manufacturing stage. testing progr...
Description	A customer who develops an MCU-based application needs various levels of flexibility in order
File Size	104.81K / 9 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	AN1235
OCR Text	... melting point of 218 to 227 c. die size and bump count are adapted to the connection requirements. figure 2. mechanical dimensions of a 5 ...wafer lots. each reel has a minimum leader of 400 mm and a minimum trailer of 160 mm (compliant wi...
Description	package description and recommendations for use
File Size	233.19K / 14 Page	View it Online	Download Datasheet

				List of Unclassifed Man...
Part No.	ZSSC3036CI1BH ZSSC3036CC1B ZSSC3036CI1CH
OCR Text	...ut ? layout customized for die - die bonding with sensor for high - dens ity chip - on - board assembly ? o ne - pass calibration ...wafer bonding * i 2 c? is a trademark of nxp. ** fso = full scale output . zssc 3036 a...
Description	Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner
File Size	1,227.49K / 49 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	AN900
OCR Text	... and very fragile silicon chip (die) and a package which is intended to protect the internal silicon chip and to provide users with a practi...wafer fabrication , is the extremely sophisticated and intricate process of manufacturing the silico...
Description	INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY
File Size	782.35K / 15 Page	View it Online	Download Datasheet

				Supertex, Inc
Part No.	TN0106N3-G
OCR Text	...ormation device package wafer / die options to-92 nw (die in wafer form) nj (die on adhesive tape) nd (die in waffe pack) tn0106 tn0106n3-g tn1506nw tn1506nj tn1506nd for packaged products, -g indicates package is rohs compliant (green). de...
Description	N-Channel Enhancement-Mode Vertical DMOS FET
File Size	527.26K / 5 Page	View it Online	Download Datasheet

For die wafer Found Datasheets File :: 4533 Search Time::2.703ms
Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |