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  74442-0114 Datasheet PDF File

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    74164-0114

Molex Electronics Ltd.
Part No. 74164-0114
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Right Angle, Through Hole, Dual Row,Shrouded with Pegs High-Temperature, 14 Circuits, Tin (Sn

File Size 392.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90160-0114

Molex Electronics Ltd.
Part No. 90160-0114
Description 2.54mm (.100) Pitch C-Grid III Crimp Housing - Dual Row, 14 Circuits

File Size 158.20K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    1-201144-8 1-201144-1 201144-3 201144-5 201144-6 201144-7

Tyco Electronics
Part No. 1-201144-8 1-201144-1 201144-3 201144-5 201144-6 201144-7
Description SOCKET MINIATURE SERIES

File Size 107.38K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    SD-120114-082

Molex Electronics Ltd.
Part No. SD-120114-082
Description Micro-Change Molded Junction Box, Top Mount, 8 Ports, LEDs for PNP sensors, with Mini-Change

File Size 114.78K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    SD-120114-077

Molex Electronics Ltd.
Part No. SD-120114-077
Description Micro-Change Molded Junction Box, Top Mount, 6 Ports, LEDs for PNP sensors, with Integral Mini-Change

File Size 111.91K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    SD-120114-075

Molex Electronics Ltd.
Part No. SD-120114-075
Description Micro-Change Molded Junction Box, Top Mount, 8 Ports, 2(IO) per port, LEDs for PNP sensors, with Integral

File Size 133.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    SD-120114-068

Molex Electronics Ltd.
Part No. SD-120114-068
Description Micro-Change Molded Junction Box, Top Mount, 8 Ports, 2(OI) per port, LEDs for PNP sensors

File Size 140.26K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    SCHURTER AG
Part No. DD11.0114.1110 DD11.0113.1110
Description DD11 POWER ENTRY MODUL 8/10A, 250VAC, MALE, MAINS POWER CONNECTOR, SOLDER

File Size 532.75K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

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    50-65-0114 70104-0013

Molex Electronics Ltd.
Part No. 50-65-0114 70104-0013
Description 2.54mm (.100) Pitch, SL Single Row Wire-to-Wire Panel Mount, 14 Circuits
2.54mm (.100") Pitch, SL垄芒 Single Row Wire-to-Wire Panel Mount, 14 Circuits

File Size 145.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    11-40-2118 1140-2118 0011-40-2118 001140-2118

Molex Electronics Ltd.
Part No. 11-40-2118 1140-2118 0011-40-2118 001140-2118
Description Terminator Die

File Size 19.94K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

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