6185 pdf Datasheet P3 Part Num --- IC-ON-LINE


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6185 Datasheet PDF File

For 6185 Found Datasheets File :: 40+ Page :: | 1 | 2 | <3> | 4 |

					MOTOROLA[Motorola, Inc] MOTOROLA[Motorola Inc]
Part No.	MHW5185B MHW6185B
Description	High Ouput Doubler 450/550 MHz CATV Amplifier Modules
File Size	52.43K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-809261850LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung semiconductor
Part No.	K7Q161854A K7Q161854A-FC10 K7Q161854A-FC13
Description	512Kx36-bit, 1Mx18-bit QDR SRAM
File Size	359.88K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-109161850LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					ST Microelectronics STMICROELECTRONICS[STMicroelectronics] 意法半导 STMicroelectronics N.V.
Part No.	M27C320 6185 M27C320-80N1 M27C320-100M1 M27C320-100N1 M27C320-120M1 M27C320-120N1 M27C320-80M1 -M27C320-120M1 -M27C320-120N1
Description	From old datasheet system 32 Mbit (4Mb x8 or 2Mb x16) OTP EPROM 32 Mbit 4Mb x8 or 2Mb x16 OTP EPROM 32兆位4Mb的x8或检察官办公室的2Mb x16存储
File Size	92.66K / 15 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-110161850LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Littelfuse
Part No.	142.6185.4402 142.6185.4406 142.6185.5156 142.6185.5102 142.6185.5152 142.6185.5106 142.6185.4106 142.6185.4202 142.6185.4206 142.6185.4302 142.6185.450 142.6185.475 142.6185.4752 142.6185.4102 142.6185.4756 142.6185.520 142.6185.5202 142.6185.5206 142.6185.4306 142.6185.4502 142.6185.4506 142.6185.525
Description	TAC ATO STYLE BLADE FUSE RATED 58V Blade contacts TAC ATO STYLE BLADE FUSE RATED 58V Copper alloy, gal. Sn plated
File Size	264.91K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10061854-11011TLF
Description	PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	106086-5213 106086-5220 106086-5221 106086-5225 106086-5226 106185-0027 106186-0013 106186-0017 106186-0021 106186-0022 106186-0025
Description	MTP* Backplane Interconnect System (BMTP)
File Size	430.46K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-109161850LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Intersil Corporation
Part No.	ISL61851DCBZ
Description	Dual USB Port Power Supply Controller
File Size	632.15K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-118161850RLF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K7Q163652A K7Q161852A
Description	512Kx36 & 1Mx18 QDRTM b2 SRAM Electrical Outlet Connector; Voltage Rating:125V; Contact Plating:Nickel; Current Rating:30A RoHS Compliant: Yes 512Kx36
File Size	503.77K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-810261850LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
Part No.	K7Q161854A-FC16 K7Q163654A-FC20 K7Q161854A-FC20 K7Q163654A K7Q163654A-FC10 K7Q163654A-FC13 K7Q163654A-FC16 K7Q161854A-FC10
Description	1M X 18 QDR SRAM, 3 ns, PBGA165 512Kx36-bit, 1Mx18-bit QDR SRAM
File Size	508.59K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54111-409261850LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					INFINEON[Infineon Technologies AG]
Part No.	Q67060-S6185 Q67060-S6186 Q67060-S6187 SPP80N06S-08 SPB80N06S-08 SPI80N06S-08
Description	TO220/262/263; 80 A; 55V; NL; 8 mOhm SIPMOS㈢ Power-Transistor SIPMOS? Power-Transistor
File Size	167.88K / 8 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	39-30-0046 39-30-0086 39-30-0026 39-30-0066 39306025 39-30-0166 39-30-6045 39-30-6025 39-30-6046 39-30-6086 39-30-6026 39-30-6065 39-30-6066 39-30-6085 39-30-6205 39-30-0206 39-30-6106 39-30-6105 39-30-0246 39-30-6146 39-30-6145 39-30-6126 39-30-6185 39-30-6125 39-30-6166 39-30-6186 39-30-6225 39-30-6226 39-30-6245 39-30-6206 39-30-6246
Description	MINI-FIT JR. VERTICAL HEADER ASSEMBLIES WITH MOUNTING PEGS
File Size	371.33K / 2 Page	View it Online	Download Datasheet

For 6185 Found Datasheets File :: 40+ Page :: | 1 | 2 | <3> | 4 |

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