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  56043 Datasheet PDF File

For 56043 Found Datasheets File :: 43+       Page :: | 1 | 2 | <3> | 4 | 5 |   

    K4H560438E-ZC/LA2 K4H560838E-ZC/LA2 K4H560438E-ZC/LB0 K4H560838E-ZC/LB0 K4H560438E-ZC/LB3 K4H560838E-ZC/LB3 K4H560838E-Z

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438E-ZC/LA2 K4H560838E-ZC/LA2 K4H560438E-ZC/LB0 K4H560838E-ZC/LB0 K4H560438E-ZC/LB3 K4H560838E-ZC/LB3 K4H560838E-ZCB3 K4H560438E-ZCB3 K4H560438E-ZLA2 K4H560838E-ZLA2 K4H560438E-ZCA2 K4H560838E-ZCB0 K4H560438E-ZCB0 K4H560838E-ZCA2 K4H560838E-ZLA20 K4H560438E-ZLA20
Description 64M X 4 DDR DRAM, 0.75 ns, PBGA60 ROHS COMPLIANT, FBGA-60
32M X 8 DDR DRAM, 0.75 ns, PBGA60 ROHS COMPLIANT, FBGA-60
CSM, CER 103PF 1000V 10% 1210
CAP, 10NF 1KV 10%, SMT, 1812
Connector Cover; Enclosure Material:Aluminum; Cable Diameter Max:25.4mm; Cable Diameter Min:20.32mm; Cable Entry:Top; For Use With:AVX/Elco 8016 Series Rack and Panel Rectangular Connectors with 90 Contacts RoHS Compliant: Yes
CONN MEMORY CARD HDR CF NORMAL
CONN EJECTOR COMPACTFLASH RIGHT
Rectangular Industrial Connector Housing; Series:C-146; No. of Contacts:10; Gender:Female; Body Material:Aluminum Alloy; Connecting Termination:Screw; For Use With:C146 Rectangular Circular Connectors; Operating Voltage:400V RoHS Compliant: Yes
COVER, SIDE ENTRY, 38WAY; For use with:8016 Series Rectangular Connectors; Material:Aluminium; Colour:Grey; Connector type:Dust Cap & Cover; Contacts, No. of:38; Ways, No. of:38 RoHS Compliant: Yes
Rectangular Industrial Connector Housing; Series:C-146; No. of Contacts:6; Gender:Female; Body Material:Aluminum Alloy; Connecting Termination:Screw; Features:Spring Cover; For Use With:C146 Rectangular Circular Connectors RoHS Compliant: Yes
256Mb E-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant)

File Size 360.28K  /  23 Page

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Amphenol Communications Solutions

Part No. 10073456-043LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    K4H560838E-VC/LB3 K4H560438E-VC/LB3 K4H560438E-VC/LA2 K4H560838E-VC/LA2 K4H560438E-VC/LB0 K4H560838E-VC/LB0 K4H560838E-V

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838E-VC/LB3 K4H560438E-VC/LB3 K4H560438E-VC/LA2 K4H560838E-VC/LA2 K4H560438E-VC/LB0 K4H560838E-VC/LB0 K4H560838E-VCA2 K4H560438E-VCA2 K4H560438E-VLB3 K4H560838E-VCB3 K4H560438E-VLB0 K4H560438E-VLA2 K4H560438E-VCB3 K4H560838E-VLB0 K4H560838E-VLA2 K4H560838E-VCB0 K4H560438E-VCB0 K4H560838E-VLB3
Description 256Mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片DDR SDRAM内存规格54 sTSOP与铅二无(符合RoHS

File Size 299.00K  /  23 Page

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Amphenol Communications Solutions

Part No. 55604-302ALF
Description DX VCC DR 100 DP SMT
Tech specs    

Official Product Page

    K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB3 K4H560438E-TC/LB3 K4H560438E-TC/LB0 K4H560438E-T

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB3 K4H560438E-TC/LB3 K4H560438E-TC/LB0 K4H560438E-TC/LA2 K4H560438E-TC/LAA K4H560838E K4H560438E-TLAA K4H560838E-TCAA K4H560838E-TLAA K4H560438E-TCAA K4H560438E-TCB3 K4H560438E-TLB3
Description DDR SDRAM 256Mb E-die (x4, x8) 256Mb的DDR SDRAM的电子芯片(了x4,x8
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-PDIP -40 to 125
256Mb E-die DDR SDRAM Specification 66 TSOP-II
Dual Micropower Precision Low-Voltage Operational Amplifier 8-SOIC -55 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PLCC
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PDIP
   DDR SDRAM 256Mb E-die (x4, x8)

File Size 216.51K  /  24 Page

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Amphenol Communications Solutions

Part No. 10136656-0431LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K

SAMSUNG[Samsung semiconductor]
Part No. K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K4H561638H K4H560838H-UC_LCC K4H560838H K4H560838H-UC_LA2 K4H560838H-UC_LB0 K4H560838H-UC_LB3
Description 256Mb H-die DDR SDRAM Specification

File Size 356.30K  /  24 Page

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Amphenol Communications Solutions

Part No. 10136656-0432LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II 256Mb的电子芯片内存规4pin sTSOP -

File Size 180.64K  /  13 Page

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Amphenol Communications Solutions

Part No. 10136656-0431NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Natural Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3

Samsung semiconductor
Part No. K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description 256Mb J-die DDR SDRAM Specification

File Size 352.76K  /  24 Page

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Amphenol Communications Solutions

Part No. 10136656-0432NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60
Description 256Mb E-die SDRAM Specification 256Mb的电子芯片内存规

File Size 194.54K  /  14 Page

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    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 196.59K  /  14 Page

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    K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E-UC75 K4S560432E-UL75
Description 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与内存规格4 TSOP-II免费(符合RoHS

File Size 196.27K  /  14 Page

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    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
Description 16M x 16 SDRAM, LVTTL, 133MHz
256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 205.22K  /  14 Page

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