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352-pbga Datasheet PDF File

For 352-pbga Found Datasheets File :: 99 Search Time::0.984ms
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				INTEL CORP
Part No.	GC80503CS166EXT GC80503CSM66266
OCR Text	...clock control n 296-pin ppga or 352-ball hl-pbga the low-power embedded pentium processor with mmx technology in the hl-pbga package is also available in extended temperature ranges from -40c to +115c. for more information, see the exten...
Description	32-BIT, 166 MHz, MICROPROCESSOR, PBGA352 32-BIT, 266 MHz, MICROPROCESSOR, PBGA352
File Size	557.15K / 65 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	MCMPBGA
OCR Text	...304/329 360/385 529 516 900 313 352/388 420/456 452 676 580 680 1,156 524 784 564 900 1.0 1.27 1.27 1.27 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.50 1.27 1.27 1.27 1.00 1.00 1.50 1.27 1.27 1.27 1.27 1.00 1.00 1.27 1.27 1.27 1.00 1.00 1.27 1....
Description	Innovative designs and expanding package offerings provide a platform from prototype-to-production
File Size	120.34K / 2 Page	View it Online	Download Datasheet

				Intel Corporation
Part No.	FV80503CSM66166
OCR Text	...clock control n 296-pin ppga or 352-ball hl-pbga the low-power embedded pentium processor with mmx technology in the hl-pbga package is also available in extended temperature ranges from -40c to +115c. for more information, see the exten...
Description	Low-Power Embedded Pentium? Processor with MMX Technology
File Size	703.75K / 62 Page	View it Online	Download Datasheet

				Intel Corp.
Part No.	I80960RD I80960RP I960
OCR Text	...e Private PCI Device Support -- 352 Ball-Grid Array (HL-PBGA) -- -- -- -- -- s SuperBGA* Package (c) INTEL CORPORATION, 1997 September, 1997 Order Number: 273001-002 Information in this document is provided in connection ...
Description	i960 RP/RD I/O PROCESSOR AT 3.3 VOLTS I/O PROCESSOR AT 3.3 VOLTS, 33 and 66 MHz
File Size	525.69K / 70 Page	View it Online	Download Datasheet

				INTEL[Intel Corporation]
Part No.	I960
OCR Text	...e Private PCI Device Support -- 352 Ball-Grid Array (HL-PBGA) -- -- -- -- -- s SuperBGA* Package (c) INTEL CORPORATION, 1997 September, 1997 Order Number: 273001-002 Information in this document is provided in connection w...
Description	i960 RP/RD I/O PROCESSOR AT 3.3 VOLTS
File Size	513.89K / 70 Page	View it Online	Download Datasheet

				Intel Corporation
Part No.	I960
OCR Text	...e Private PCI Device Support -- 352 Ball-Grid Array (HL-PBGA) -- -- -- -- -- s SuperBGA* Package (c) INTEL CORPORATION, 1997 September, 1997 Order Number: 273001-002 Information in this document is provided in connection w...
Description	i960 RP/RD I/O PROCESSOR AT 3.3 VOLTS
File Size	513.88K / 70 Page	View it Online	Download Datasheet

				Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited]
Part No.	CE66P2 CE66P4 CE66P5 CE66PE CE66P1 CE66P3 CE66P6 CE66P7 CE66P8 CE66P9 CE66PA CE66PB CE66PC CE66PD CE66PF CE66SA CE66 CE66S1 CE66S2 CE66S3 CE66S4 CE66S5 CE66S6 CE66S7 CE66S8 CE66S9
OCR Text	...224 240 256 272 288 304 320 336 352 Signals 126 138 132 152 178 178 178 206 228 228 228 264 264 264 312 S-Series with 70m Inline Pad ...PBGA 256 352 FBGA 112 144 168 176 192 224 288 Frame Size P1, P2, P3, P4, P5, P6, P7, P8, P9, PA, ...
Description	0.35um CMOS Technology
File Size	24.18K / 2 Page	View it Online	Download Datasheet

				LATTICE SEMICONDUCTOR CORP
Part No.	OR4E02 OR4E02-1BA352I OR4E02-1BM416C OR4E02-1BM416I OR4E02-1BM680C OR4E02-1BM680I OR4E02-2BA352I OR4E02-2BM416C OR4E02-2BM416I OR4E02-2BM680C OR4E02-2BM680I OR4E02-3BM416C OR4E02-3BM680C OR4E04 OR4E04-1BA352I OR4E04-1BM416C OR4E04-1BM416I OR4E04-1BM680C OR4E04-1BM680I OR4E04-2BA352I OR4E04-2BM416C OR4E04-2BM416I OR4E04-2BM680C OR4 OR4E04-3BM416C OR4E04-2BM680I OR4E04-3BM680C
OCR Text	.............................. 105 352-Pin PBGA Pinout ...................................... 107 416-Pin BGAM Pinout ..................................... 116 680-Pin PBGAM Pinout ................................... 126 Package Thermal Charac...
Description	FPGA, 1296 CLBS, 333000 GATES, PBGA416 FPGA, 1296 CLBS, 333000 GATES, PBGA680 ORCASeries 4 FPGAs
File Size	1,044.32K / 152 Page	View it Online	Download Datasheet

				ETC
Part No.	STP2223BGA
OCR Text	...MOS technology. The U2P die has 352 signal pads (including specialty power/grounds) and 104 VSS/VDD pads for a total pad count of 456. The U2P package is a 456 pin PBGA, with 352 signal pins and 104 VSS/VDD pins. Its die consists of 170k ga...
Description	UPA to PCI Interface
File Size	152.14K / 34 Page	View it Online	Download Datasheet

For 352-pbga Found Datasheets File :: 99 Search Time::0.984ms
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