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PROTEC[Protek Devices]
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Part No. |
LC0408FC3.3C07 LC0408FC36C LC0408FC05C LC0408FC08C LC0408FC12C LC0408FC15C LC0408FC24C LC0408FC3.3C LC0408FC3.3C-LF LC0408FC3.3C-T75-1
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OCR Text |
...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ... |
Description |
200 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, DO-201 FLIP CHIP-8 200 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE ROHS COMPLIANT, FLIP CHIP-8 LOW CAPACITANCE FLIP CHIP ARRAY
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File Size |
75.94K /
6 Page |
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it Online |
Download Datasheet
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California Micro Devices Corporation CALMIRCO[California Micro Devices Corp]
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Part No. |
PACDN2404CR PACDN2404C PACDN2416CR PACDN2408C PACDN2408CR PACDN2416C
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OCR Text |
.../50 No Clean OSP (Entek Cu Plus 106a)
250 EXH 225 200
Temperature (oC)
PH
Z2
Z3
Z4
Z5
RF
CD
EXH
175 150 125 100 75 50 25 0 48 97 145 194 Time (s) 242 290 339 387 435
Typical Solder Reflow Thermal Profile (N... |
Description |
ESD PROTECTION ARRAYS CHIP SCALE PACKAGE ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE
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File Size |
50.28K /
3 Page |
View
it Online |
Download Datasheet
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Price and Availability
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