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  0071.1281.B1 Datasheet PDF File

For 0071.1281.B1 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    45984-1281

Molex Electronics Ltd.
Part No. 45984-1281
Description 1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 10 Power Contacts
1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 10 Power Contacts

File Size 451.78K  /  7 Page

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Amphenol Communications Solutions

Part No. 54112-812242300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    51281-1694

Molex Electronics Ltd.
Part No. 51281-1694
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047) Mated Height, 16 Circuits, Lead-free, Gold (Au) Plating
0.50mm (.020") Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047") Mated Height, 16 Circuits, Lead-free, Gold (Au) Plating

File Size 435.33K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-810102150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75900-1281

Molex Electronics Ltd.
Part No. 75900-1281
Description
File Size 126.05K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811042500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51281-1294

Molex Electronics Ltd.
Part No. 51281-1294
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047) Mated Height, 12 Circuits, Lead-free, Gold (Au) Plating

File Size 435.25K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-812102450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51281-0694

Molex Electronics Ltd.
Part No. 51281-0694
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047) Mated Height, 6 Circuits, Lead-free, Gold (Au) Plating

File Size 435.26K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-810142000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51281-1894

Molex Electronics Ltd.
Part No. 51281-1894
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual Contact Style, 1.20mm (.047) Mated Height, 18 Circuits, Lead-free, Gold (Au) Plating

File Size 435.19K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-812061000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51281-0894

Molex Electronics Ltd.
Part No. 51281-0894
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047) Mated Height, 8 Circuits, Lead-free, Gold (Au) Plating

File Size 435.25K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-811202000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51281-0594

Molex Electronics Ltd.
Part No. 51281-0594
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual ContactStyle, 1.20mm (.047) Mated Height, 5 Circuits, Lead-free, Gold (Au) Plating

File Size 435.26K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-811102500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51281-2094

Molex Electronics Ltd.
Part No. 51281-2094
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Right Angle, Non-ZIF, Dual Contact Style, 1.20mm (.047) Mated Height, 20 Circuits, Lead-free, Gold (Au) Plating

File Size 435.25K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-810241800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    2007198-2

Tyco Electronics
Part No. 2007198-2
Description SFP IXI CAGE ASSEMBLY, PRESS FIT, EXTERNAL EMI SPRINGS

File Size 320.19K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-812122200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 0071.1281.B1 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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