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resin-molded Datasheet PDF File

For resin-molded Found Datasheets File :: 863 Search Time::2.813ms
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				PANASONIC[Panasonic Semiconductor]
Part No.	CNA1301H
OCR Text	...e integrated in a double molded resin package. 1.2 2.00.5 Optical center (1.0) Ultraminiature : 3.8 x 4.2 mm (height : 4.2 mm) Highly precise position detection : 0.15 mm Gap width : 1.4 mm Support for thin equipment (permits direc...
Description	Photo Interrupter
File Size	62.53K / 3 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TORX173 TORX173F
OCR Text	...ing module case uses conductive resin, shield by connecting the reinforcing pin at a front end of the module to GND. When using this optical...molded construction with wire fixed by resin. This structure is relatively sound against vibration o...
Description	FIBER OPTIC RECEIVING MODULE FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO EQUIPMENT
File Size	129.93K / 7 Page	View it Online	Download Datasheet

				TOSHIBA[Toshiba Semiconductor]
Part No.	TORX176
OCR Text	...ing module case uses conductive resin, shield by connecting the reinforcing pin at a front end of the module to GND. When using this optical...molded construction with wire fixed by resin. This structure is relatively sound against vibration o...
Description	FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO EQUIPMENT
File Size	138.87K / 8 Page	View it Online	Download Datasheet

				Hi-Sincerity Microelectronics Hi-Sincerity Mocroelectronics
Part No.	H1N4007 H1N4004 H1N4001 H1N4002 H1N4148
OCR Text	...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserv...
Description	75V high-speed switching diode General Purpose Rectifiers
File Size	19.09K / 2 Page	View it Online	Download Datasheet

				TOKO[TOKO, Inc]
Part No.	TK11811 TK11811D1 TK11811M TK11811MTL
OCR Text	...m electrolytic. HANDLING MOLDED RESIN PACKAGES All plastic molded packages absorb some moisture from the air. If moisture absorption occurs prior to soldering the device into the printed circuit board, increased separation of the lead from ...
Description	DC-DC CONVERTER
File Size	60.53K / 8 Page	View it Online	Download Datasheet

				TOKO[TOKO, Inc]
Part No.	TK11812 TK11812M TK11812MD2 TK11812MTL
OCR Text	...m electrolytic. HANDLING MOLDED RESIN PACKAGES All plastic molded packages absorb some moisture from the air. If moisture absorption occurs prior to soldering the device into the printed circuit board, increased separation of the lead from ...
Description	DC-DC CONVERTER
File Size	53.86K / 8 Page	View it Online	Download Datasheet

				HSMC[Hi-Sincerity Mocroelectronics] HI-SINCERITY MICROELECTRONICS, CORP. HSMC CORP.
Part No.	HSMA4004 HSMA4007 HSMA4005 HSMA4001 HSMA4003 HSMA4006 HSMA4002
OCR Text	...plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserv...
Description	1.0AMP.SURFACE MOUNT RECTIFIERS 1.0AMP.SURFACE贴装二极
File Size	36.84K / 3 Page	View it Online	Download Datasheet

				??????浣? SGS Thomson Microelectronics STMICROELECTRONICS[STMicroelectronics] 意法半导
Part No.	AM1517-025 M1517-025
OCR Text	...T CERAMIC CHIP CAPACITOR 1000pF RESIN SEALED # 8-35 THREADED FEEDTHRU CAPACITOR 0.1F/50v CERAMIC MOLDED RADIAL LEAD CAPACITOR 3 TURN AIR WOUND COIL #26AWG, ID. 0.070 [1.77] BUS BAR WIRE 3 TURN AIR WOUND COIL #26AWG, ID. 0.070 [1.77] BUS BAR...
Description	RF & MICROWAVE TRANSISTORS SATELLITE COMMUNICATIONS APPLICATIONS RF & MICROWAVE TRANSISTORS SATELLITE COMMUNICATIONS APPLICATIONS
File Size	83.71K / 8 Page	View it Online	Download Datasheet

				Hi-Sincerity Microelectronics HSMC CORP. HSMC[Hi-Sincerity Mocroelectronics] Hi-Sincerity Mocroelectroni...
Part No.	H1N5819 H1N5818 H1N5817
OCR Text	... plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reser...
Description	1.0AMP.SCHOTTKY BARRIER RECTIFIERS
File Size	37.26K / 3 Page	View it Online	Download Datasheet

				ETC NAIS[Nais(Matsushita Electric Works)]
Part No.	AQV112KL AQY2 AQV1
OCR Text	...todiode via transparent silicon resin. For this reason, unlike other directory element molded resin products (e.g., MOS transistors and bipolar transistors), avoid ultrasonic cleansing if at all possible. We recommend cleaning with an organ...
Description	Circular Connector; No. of Contacts:4; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:20; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No ER 20C 20#16 SKT RECP ER 6C 3#16 3#8 SKT RECP WALL PhotoMOS RELAYS
File Size	134.48K / 6 Page	View it Online	Download Datasheet

For resin-molded Found Datasheets File :: 863 Search Time::2.813ms
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