L-14013 pdf Datasheet P2 Part Num --- IC-ON-LINE


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L-14013 Datasheet PDF File

For L-14013 Found Datasheets File :: 28+ Page :: | 1 | <2> | 3 |

					MOTOROLA INC
Part No.	MC14013BCLD
Description	4000/14000/40000 SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14
File Size	133.30K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-401-31LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Motorola / Freescale Semiconductor MOTOROLA[Motorola, Inc] ON Semi MOTOROLA[Motorola Inc]
Part No.	MC14013B MC14013 ON0841 MC14013BCL
Description	Dual Type D Flip-Flop ORDERING INFORMATION From old datasheet system
File Size	210.91K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L17H2140131
Description	Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/15 (Pin/Socket), Flash Gold, Bright Tin Shell, 4-40 Removable Front Screwlock, 4*Arrowhead Boardlock
Tech specs				Official Product Page

					Advanced Thermal Solutions, Inc.
Part No.	ATS014014013-MF-3L
Description	14.00 x 14.00 x 13.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size	279.98K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	ME1014013401311
Description	Mini Cool Edge 0.60mm,Storage and Server connector ,Gen Z,EDSFF,OCP 3.0,140 signal pins, SMT, OCP, Straddle mount, 1.93mmPCB,-0.3mm offset
Tech specs				Official Product Page

					Advanced Thermal Solutions, Inc.
Part No.	ATS014014013-SF-3L
Description	114.00 x 14.00 x 13.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin
File Size	278.07K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-401-35LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					Advanced Thermal Solutions, Inc.
Part No.	ATS014014013-PF-3L
Description	14.00 x 14.00 x 13.00 mm BGA Heat Sink (HIgh Aspect Ratio Ext.) Custom Pin Fin
File Size	250.07K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	MET008431401311
Description	Mini Cool Edge 0.60mm, Storage and Server connector, Gen Z, EDSFF, 84 signal pins, SMT, Straddle mount, 1.93mmPCB, -0.3mm offset
Tech specs				Official Product Page

					Motorola
Part No.	MS140132KT MS140132KTPB
Description	MC1420233, MC1430132, MS140132KT, MC140132KTPB SH-POTS Chipset MC1420233 CODSP, MC1430132 SHLIC
File Size	72.66K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	ME1014013401201
Description	Mini Cool Edge 0.60mm Connectors, Storage & Server System, Gen Z,EDSFF,OCP 3.0,140 signal pins, SMT,Straddle mount, 2.36mm PCB,0.0mm offset .
Tech specs				Official Product Page

					Motorola
Part No.	MS140131KT MS140131KTPP
Description	MC1420232, MC1430132, MS140131KT, MC140131KTPP SH POTS Chipset MC1420232 CODSP, MC1430132 SHLIC SH-POTS Chipset
File Size	92.17K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-401-36LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					ON Semiconductor
Part No.	MC14013BD MC14013BDR2 MC14013BFEL
Description	Dual D-Type Flip-Flop
File Size	107.25K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-401-32LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					ON Semiconductor
Part No.	MC14013BDTR2 MC14013BF MC14013BCP
Description	Dual D-Type Flip-Flop
File Size	169.95K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-401-33LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					ON Semiconductor
Part No.	NLV14013BDG NLV14013BDTR2G
Description	Dual Type D Flip-Flop
File Size	115.75K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-401-30LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

For L-14013 Found Datasheets File :: 28+ Page :: | 1 | <2> | 3 |

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