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  K7J641882M-FC30 Datasheet PDF File

For K7J641882M-FC30 Found Datasheets File :: 44+       Page :: | 1 | <2> | 3 | 4 | 5 |   

    THOMAS & BETTS CORP
Part No. FC303V MC410V MC410VX2
Description RECTANGULAR CONNECTOR

File Size 337.74K  /  6 Page

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Amphenol Communications Solutions

Part No. L717SDA15P1ACH4FC309
Description Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 15 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, 4-40 Front Screwlock, Ground Tab with Boardlock
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    CEFC305 CEFC301 CEFC302 CEFC303 CEFC304

COMCHIP[Comchip Technology]
Part No. CEFC305 CEFC301 CEFC302 CEFC303 CEFC304
Description SMD Efficient Fast Recovery Rectifier

File Size 55.02K  /  2 Page

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Amphenol Communications Solutions

Part No. L77SDC37SA4CH3FC309
Description Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 37 Socket, 0.76m (30in) Gold, Bright Tin Shell, M3 Front Screwlock, Ground Tab with Boardlock
Tech specs    

Official Product Page

    CSFC305 CSFC302 CSFC301 CSFC303 CSFC304

COMCHIP[Comchip Technology]
Part No. CSFC305 CSFC302 CSFC301 CSFC303 CSFC304
Description SMD Super Fast Recovery Rectifier

File Size 59.32K  /  2 Page

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Amphenol Communications Solutions

Part No. L77SDE09SABCH4FC309
Description Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=14.84mm (0.584in), Row Pitch 2.84mm, 09 Socket, 0.76m (30in) Gold, Bright Tin Shell, 4-40 Front Screwlock, Ground Tab with Boardlock
Tech specs    

Official Product Page

    COMCHIP[Comchip Technology]
Part No. CEFC305-G CEFC301-G CEFC302-G CEFC303-G CEFC304-G
Description SMD Efficient Fast Recovery Rectifier

File Size 66.96K  /  2 Page

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Amphenol Communications Solutions

Part No. L77HDCH62SVFC309
Description Dsub, Stamped Signal 3A, Straight Soldercup, 62 Socket, Bright Tin Shell, 0.76m (30 in) Gold, 4-40 Removable Front Screwlock, 4-40 Rear Nut
Tech specs    

Official Product Page

    IXFC30N60P

IXYS Corporation
Part No. IXFC30N60P
Description PolarHV HiPerFET Power MOSFET

File Size 131.22K  /  4 Page

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Amphenol Communications Solutions

Part No. L717SDB25PVFC309
Description D-Sub Standard Density Connector, Input Output Connectors, Stamped Signal 3A, Straight Solder Cup, 25 Position Plug, 0.76um (29.921u\\) Gold Plating
Tech specs    

Official Product Page

   
Part No. GP1FC300TP
Description FIBER OPTIC TRANSMITTERS

File Size 34.75K  /  2 Page

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Amphenol Communications Solutions

Part No. L77SDAH15SVFC309
Description D-Sub Standard Density Connector, Input Output Connectors, Stamped Signal 3A, Straight Solder Cup, 15 Position Receptacle, 0.76um (29.921u\\) Gold Plating
Tech specs    

Official Product Page

   
Part No. K7J160882B-FC300
Description 2M X 8 DDR SRAM, 0.45 ns, PBGA165

File Size 181.41K  /  18 Page

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Amphenol Communications Solutions

Part No. L717SDC37P1ACH3FC309
Description Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 37 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, M3 Front Screwlock, Ground Tab with Boardlock
Tech specs    

Official Product Page

    K7J643682M07 K7J641882M

Samsung semiconductor
Part No. K7J643682M07 K7J641882M
Description 2Mx36 & 4Mx18 DDR II SIO b2 SRAM

File Size 429.81K  /  18 Page

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Part No. L717SDC37PA4CH4FC309
Description Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 37 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, 4-40 Front Screwlock, Ground Tab with Boardlock
Tech specs    

Official Product Page

    K7I161882B-FC16 K7I161882B-FC20 K7I161882B-FC25 K7I161882B-FC30 K7I163682B-FC30 K7I163682B K7I163682B-FC16 K7I163682B-FC

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K7I161882B-FC16 K7I161882B-FC20 K7I161882B-FC25 K7I161882B-FC30 K7I163682B-FC30 K7I163682B K7I163682B-FC16 K7I163682B-FC20 K7I163682B-FC25
Description 512Kx36-bit, 1Mx18-bit DDRII CIO b2 SRAM 512Kx36位,1Mx18位首席信息官b2DDRII的SRAM
GT 35C 35#16 PIN PLUG RTANG

File Size 375.70K  /  17 Page

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Part No. L77SDB25S1ACH3FC309
Description Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 25 Socket, 0.76m (30in) Gold, Bright Tin Shell, M3 Front Screwlock, Ground Tab with Boardlock
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K7I643682M-FC30 K7I641882M K7I641882M-EI16 K7I641882M-EI20 K7I641882M-EI25 K7I641882M-EI30 K7I641882M-FC16 K7I641882M-FC20 K7I641882M-FC25 K7I641882M-FC30 K7I643682M K7I643682M-EI16 K7I643682M-EI20 K7I643682M-EI25 K7I643682M-EI30 K7I643682M-FC16 K7I643682M-FC20 K7I643682M-FC25
Description 72Mb M-die DDRII SRAM Specification 165 FBGA with Pb & Pb-Free (RoHS compliant)

File Size 301.37K  /  17 Page

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Amphenol Communications Solutions

Part No. L77SDE09S1ACH4FC309
Description Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 09 Socket, 0.76m (30in) Gold, Bright Tin Shell, 4-40 Front Screwlock, Ground Tab with Boardlock
Tech specs    

Official Product Page

For K7J641882M-FC30 Found Datasheets File :: 44+       Page :: | 1 | <2> | 3 | 4 | 5 |   

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