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For interpret Found Datasheets File :: 983    Search Time::1.094ms    
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    飞思卡尔半导体(中国)有限公司
Part No. MPXM2010D
OCR Text ...1. dimensions are in inches. 2. interpret dimensions and tolerances per asme y14.5m--1994. 3. dimensions ?d? and ?e1? do not include mold flash or protrusion. mold flash or protrusion shall not exceed .006? per side. 4. all vertical surface...
Description 10kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors(10kPa片内温度补偿和校准硅压力传感 10kPa片上温度补偿

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    LMH020-0850-27G9-00000TW LMH020-0850-30G9-00000TW LMH020-0850-35G9-00000TW LMH020-0850-40G9-00000TW LMD125-0017-C440-300

Cree, Inc
Part No. LMH020-0850-27G9-00000TW LMH020-0850-30G9-00000TW LMH020-0850-35G9-00000TW LMH020-0850-40G9-00000TW LMD125-0017-C440-3000000 LMD125-0018-C440-1010000 LMD125-0018-C440-2010000 LMH020-1250-30G9-00000TW LMH020-1250-40G9-00000TW LMH020-1250-27G9-00000TW LMH020-1250-35G9-00000TW
OCR Text ...material thickness unless noted interpret geometric tolerancing per: material finish material finish drawn checked eng appr. mfg appr. q.a. comments: date name title: size b dwg. no. rev weight: scale: 1:1 unless otherwise specified: a dnr ...
Description Cree? LMH2 850-lm and 1250-lm LED Modules with TrueWhite? Technology

File Size 514.23K  /  3 Page

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    PTMA210452EL PTMA210452FL

Infineon Technologies AG
Part No. PTMA210452EL PTMA210452FL
OCR Text ...?unless otherwise specified: 1. interpret dimensions and tolerances per asme y14.5m-1994. 2. pins: s = source; see page 10 for complete list and diagram. 3. lead thickness: 0.127 0.025 [0.005 0.001]. 4. gold plating less than 0.25 micron ...
Description Wideband RF LDMOS Integrated Power Amplifier 45 W, 1900 ?2200 MHz

File Size 377.68K  /  11 Page

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    Freescale Semiconductor
Part No. MPVZ7025
OCR Text ...4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" do...
Description Integrated Silicon Pressure Sensor On-Chip SIgnal Conditioned

File Size 148.83K  /  10 Page

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    PTFA142401EL PTFA142401FL

Infineon Technologies AG
Part No. PTFA142401EL PTFA142401FL
OCR Text ...?unless otherwise specified: 1. interpret dimensions and tolerances per asme y14.5m-1994. 2. primary dimensions are mm. alternate dimensions are inches. 3. all tolerances 0.127 [.005] unless specified otherwise. 4. pins: d = drain, s = sou...
Description Thermally-Enhanced High Power RF LDMOS FET 240 W, 1450 ?1500 MHz

File Size 439.80K  /  10 Page

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    B43750

EPCOS
Part No. B43750
OCR Text ...) depending on the application, interpret the graph as follows: 1. natural cooling use rated current i ~ r and ambient temperature t a . 2. cooling of base use rated current i ~ r (b) and temperature of capacitor base t b . 3. cooli...
Description (B43750 / B43770) Capacitors

File Size 181.37K  /  9 Page

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    飞思卡尔半导体(中国)有限公司
Part No. MRF18030BLR3
OCR Text ...controlling dimension: inch. 2. interpret dimensions and tolerances per asme y14.5m, 1994. 3. dimension h is measured 0.030 (0.762) away from package body. 4. information only: corner break (4x) to be .060 .005 (1.52 0.13) radius or .06 ...
Description RF Power Field Effect Transistors N-Channel Enhancement-Mode Lateral MOSFETs

File Size 344.88K  /  8 Page

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    飞思卡尔半导体(中国)有限公司
Part No. MPXV7007GC6T1
OCR Text ...4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" do...
Description Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

File Size 127.63K  /  12 Page

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    Infineon Technologies
Part No. PTFA142401EL
OCR Text ...?unless otherwise specified: 1. interpret dimensions and tolerances per asme y14.5m-1994. 2. primary dimensions are mm. alternate dimensions are inches. 3. all tolerances 0.127 [.005] unless specified otherwise. 4. pins: d = drain, s = sou...
Description Thermally-Enhanced High Power RF LDMOS FET

File Size 456.56K  /  10 Page

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    MPVZ7025G6U MPVZ7025GC6T1 MPVZ7025GC6U MPVZ7025G6T1 MPVZ7025DP MPXV7025 MPVZ7025GP

Freescale Semiconductor, Inc
FREESCALE SEMICONDUCTOR INC
Part No. MPVZ7025G6U MPVZ7025GC6T1 MPVZ7025GC6U MPVZ7025G6T1 MPVZ7025DP MPXV7025 MPVZ7025GP
OCR Text ...4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" do...
Description Integrated Silicon Pressure Sensor On-Chip SIgnal Conditioned, Temperature Compensated and Calibrated
GAGE, PEIZORESISTIVE PRESSURE SENSOR, -3.6-3.6Psi, 5%, 0.20-4.70V, SQUARE, SURFACE MOUNT
DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, -3.6-3.6Psi, 5%, 0.20-4.70V, SQUARE, SURFACE MOUNT

File Size 119.31K  /  10 Page

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