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  G080.020A113 Datasheet PDF File

For G080.020A113 Found Datasheets File :: 51+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 |   

   
Part No. EKLDL080 EKLPG080 EKLPG045 EKLPG050
Description Logic IC
Low-Voltage, Single and Dual Supply, 8 to 1 Multiplexer and Differential 4 to 1 Multiplexer; Temperature Range: -40°C to 85°C; Package: 20-QFN
3.3V, Half Duplex, 30Mbps, RS-485/RS-422 Transceiver; Temperature Range: -40°C to 85°C; Package: 8-SOIC T&R
3.3V, Half Duplex, 30Mbps, RS-485/RS-422 Transceiver; Temperature Range: -40&deg;C to 85&deg;C; Package: 8-SOIC T&amp;R 逻辑IC
Low-Voltage, Single Supply, 4 to 1 Multiplexer, High Performance Analog Switch; Temperature Range: -40&deg;C to 85&deg;C; Package: 16-QFN T&amp;R

File Size 77.73K  /  1 Page

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Amphenol Communications Solutions

Part No. 54202-G08-05
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Taiyo Yuden (U.S.A.), I...
Part No. TVS042CG080CC-W
Description Multilayer Ceramic Capacitors for High Frequency Applications

File Size 129.74K  /  1 Page

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Amphenol Communications Solutions

Part No. 98414-G08-06LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Through Hole, Double Row, 6 Position ,2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. TVS042CG080DC-W
Description Multilayer Ceramic Capacitors for High Frequency Applications

File Size 129.74K  /  1 Page

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Amphenol Communications Solutions

Part No. 54202-G0803LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. UMK105CG080DV-F
Description Standard Multilayer Ceramic Capacitors (Temperature compensating type)

File Size 302.75K  /  2 Page

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Amphenol Communications Solutions

Part No. 57102-G08-04LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 8 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. HMK105CG080DV-F
Description Medium-high Voltage Multilayer Ceramic Capacitors

File Size 131.81K  /  1 Page

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Amphenol Communications Solutions

Part No. 98414-G08-04LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Through Hole, Double Row, 4 Position ,2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. UMK063CG080DT-F
Description Standard Multilayer Ceramic Capacitors (Temperature compensating type)

File Size 282.76K  /  2 Page

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Amphenol Communications Solutions

Part No. 54202-G0805LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. TMK042CG080CD-W
Description Lifecycle Stage

File Size 281.60K  /  2 Page

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Amphenol Communications Solutions

Part No. 57102-G08-07LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 14 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. EMK042CG080CD-W
Description Standard Multilayer Ceramic Capacitors

File Size 281.73K  /  2 Page

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Amphenol Communications Solutions

Part No. 54202-G0805CLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Intel
Part No. JM80547PG0802M
Description Processor Extreme Edition

File Size 1,558.07K  /  98 Page

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Amphenol Communications Solutions

Part No. 57102-G08-09LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 18 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. UMK105CG080DVHF
Description MLCC (Temperature compensating type) for Automotive

File Size 303.26K  /  2 Page

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Amphenol Communications Solutions

Part No. 54201-G0803ALF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For G080.020A113 Found Datasheets File :: 51+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 |   

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