| |
|
 |
BITECH[Bi technologies]
|
| Part No. |
143
|
| OCR Text |
...ons and many quality and design advantages. Resistors are directly screened onto the substrate and other components are typically surface mounted. Chip and wire attachment is available for components where required. A variety of lead frame ... |
| Description |
Custom Commercial Modules
|
| File Size |
119.00K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
http://
FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
|
| Part No. |
AN-5026
|
| OCR Text |
...mcorders 6. Digital cameras BGA advantages compared to fine pitch QFP or TSSOP packages: 1. BGAs are usually smaller. 2. BGAs have larger pitch. 3. BGAs have no fragile leads, that causes yield and rework problems. 4. Board assembly yields ... |
| Description |
Using BGA Packages
Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No
|
| File Size |
720.16K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
RFMD[RF Micro Devices]
|
| Part No. |
TA0012
|
| OCR Text |
... generation handsets must offer advantages to the consumer. These generally take the form of lower cost, smaller size, and longer battery life. One component which has traditionally been either expensive, large, power-hungry, or any combina... |
| Description |
New High Power, High Efficiency HBT GSM Power Amplifier
|
| File Size |
73.22K /
4 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
