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  87834-1419 Datasheet PDF File

For 87834-1419 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87834-2641

Molex Electronics Ltd.
Part No. 87834-2641
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 77314-190LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-2411

Molex Electronics Ltd.
Part No. 87834-2411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 24 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-419041650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-5011

Molex Electronics Ltd.
Part No. 87834-5011
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 50 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 50 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.42K  /  3 Page

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Amphenol Communications Solutions

Part No. 10141998-001RLF
Description DDR4 SODIMM 260pin SMT, 4.0H, reverse version., Right Angle
Tech specs    

Official Product Page

    87834-5019

Molex Electronics Ltd.
Part No. 87834-5019
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, 50 Circuits, 0.13渭m (5渭) Gold (Au) Plating, Black, without PCB Locator
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 50 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 114.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 68461-419HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
Tech specs    

Official Product Page

    87834-5021

Molex Electronics Ltd.
Part No. 87834-5021
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13渭m (5渭) Gold (Au) Flash Plating, Nylon Housin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.27K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-419-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    87834-5095

Molex Electronics Ltd.
Part No. 87834-5095
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05渭m (2渭) Gold (Au) Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 10141995-004RLF
Description DDR4 SODIMM 260pin SMT, 8.0H, STANDARD VERSION, Right Angle
Tech specs    

Official Product Page

    87834-2045

Molex Electronics Ltd.
Part No. 87834-2045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 20 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 76341-419LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 19 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 87834-3041
Description CGrid Hdr W/Pg/Slt 1PdNiAuLF 30Ckt 30 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 94.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 94611-419HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-4411

Molex Electronics Ltd.
Part No. 87834-4411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded Lead-free, 44 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded Lead-free, 44 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.58K  /  3 Page

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Amphenol Communications Solutions

Part No. U77C14192001
Description ExpressPort SFP+, High Speed Input Output Connectors, 1X1 SFPP CAGE W/ LP.
Tech specs    

Official Product Page

    87834-4419

Molex Electronics Ltd.
Part No. 87834-4419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13楼矛m (5楼矛) Gold (Au) Plating, Black, without PCB Locator

File Size 115.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-419-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 06 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 87834-1419 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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