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  87831-4821 Datasheet PDF File

For 87831-4821 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87831-5021

Molex Electronics Ltd.
Part No. 87831-5021
Description 2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot

File Size 218.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 68482-118HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87831-3421

Molex Electronics Ltd.
Part No. 87831-3421
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 34 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot

File Size 218.01K  /  4 Page

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Amphenol Communications Solutions

Part No. 68482-142HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87831-5019

Molex Electronics Ltd.
Part No. 87831-5019
Description 2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Leadfree 50 Circuits, 0.05-0.127μm (2-5μ) Gold (Au) Plating, Center Polarization Slot

File Size 218.12K  /  4 Page

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Amphenol Communications Solutions

Part No. 68482-162HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87831-3220

Molex Electronics Ltd.
Part No. 87831-3220
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 32 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot

File Size 218.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 68448-218HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87831-0621

Molex Electronics Ltd.
Part No. 87831-0621
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, without Center Polarization Slot

File Size 217.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 78548-212HLF
Description BERGSTIK II DR STRAIGHT-RET
Tech specs    

Official Product Page

    87831-3429

Molex Electronics Ltd.
Part No. 87831-3429
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 34 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot

File Size 189.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 68482-102HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87831-3228

Molex Electronics Ltd.
Part No. 87831-3228
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 32 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot

File Size 189.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 68482-124HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87831-3221

Molex Electronics Ltd.
Part No. 87831-3221
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 32 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot

File Size 218.01K  /  4 Page

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Amphenol Communications Solutions

Part No. 68482-146HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87831-0620

Molex Electronics Ltd.
Part No. 87831-0620
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, without Center Polarization Slot

File Size 217.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 68482-166HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87831-3028

Molex Electronics Ltd.
Part No. 87831-3028
Description 2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 30 Circuits, 0.38μm

File Size 189.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 68448-215HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For 87831-4821 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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