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  54776 Datasheet PDF File

For 54776 Found Datasheets File :: 33+       Page :: | 1 | <2> | 3 | 4 |   

    0015477606

Molex Electronics Ltd.
Part No. 0015477606
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-605-36LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015477658

Molex Electronics Ltd.
Part No. 0015477658
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-101-36LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477656

Molex Electronics Ltd.
Part No. 0015477656
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 56 Circuits

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-604-06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477654

Molex Electronics Ltd.
Part No. 0015477654
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 377.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-111-08LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 8 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477648

Molex Electronics Ltd.
Part No. 0015477648
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-110-24LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 24 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477652

Molex Electronics Ltd.
Part No. 0015477652
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-602-36LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477620

Molex Electronics Ltd.
Part No. 0015477620
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.31K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-105-26LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477632 15-47-7632

Molex Electronics Ltd.
Part No. 0015477632 15-47-7632
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin

File Size 377.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-102-36LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477634 15-47-7634

Molex Electronics Ltd.
Part No. 0015477634 15-47-7634
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin

File Size 377.52K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-106-40LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 40 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477636 15-47-7636

Molex Electronics Ltd.
Part No. 0015477636 15-47-7636
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin

File Size 377.46K  /  4 Page

View it Online

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Amphenol Communications Solutions

Part No. 54776-108-16LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 54776 Found Datasheets File :: 33+       Page :: | 1 | <2> | 3 | 4 |   

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