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  44067-1201 Datasheet PDF File

For 44067-1201 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0440672001 44067-2001

Molex Electronics Ltd.
Part No. 0440672001 44067-2001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 70451-2019LF
Description 4 Row Signal Header, 72 Position, Straight, Press-Fit, Wide body
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0440672002 44067-2002

Molex Electronics Ltd.
Part No. 0440672002 44067-2002
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 85758-1201LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Straight, Press-Fit.
Tech specs    

Official Product Page

    0440671401 44067-1401

Molex Electronics Ltd.
Part No. 0440671401 44067-1401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector

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Amphenol Communications Solutions

Part No. 51700-10101201ACLF
Description PwrBlade®, Power Supply Connectors, 1P 12S 1 STB Vertical Header.
Tech specs    

Official Product Page

    44067-0603 0440670603

Molex Electronics Ltd.
Part No. 44067-0603 0440670603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 74221-201LF
Description 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    44067-0802 0440670802

Molex Electronics Ltd.
Part No. 44067-0802 0440670802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10116951-2010HLF
Description CXP Passive Copper Cable Assemblies, Passive, 10Gb/s, 30 AWG, 1.0m, Halogen free
Tech specs    

Official Product Page

    44067-0601 0440670601

Molex Electronics Ltd.
Part No. 44067-0601 0440670601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 90312-014LF
Description Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 14 Position
Tech specs    

Official Product Page

    44067-0403 0440670403

Molex Electronics Ltd.
Part No. 44067-0403 0440670403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv

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Amphenol Communications Solutions

Part No. 55741-201
Description GIG-Array®, Mezzanine Connectors, 15mm Recetpacle 200 Position .
Tech specs    

Official Product Page

    44067-0402 0440670402

Molex Electronics Ltd.
Part No. 44067-0402 0440670402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

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Amphenol Communications Solutions

Part No. 90312-011LF
Description Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 11 Position
Tech specs    

Official Product Page

    44067-0401 0440670401

Molex Electronics Ltd.
Part No. 44067-0401 0440670401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 108-1411-201
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, Guide Module, Ground Contact, No Key.
Tech specs    

Official Product Page

    44067-0201 0440670201

Molex Electronics Ltd.
Part No. 44067-0201 0440670201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.09K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-201HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 44067-1201 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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