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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
LFBGA-H FBGA
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OCR Text |
...0.2 Thermal Performance ja(C/W) 34.1 19.4
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-9) under natural convection as defined in JESD51-2.
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly depen... |
Description |
Fine Pitch Ball Grid Array
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File Size |
555.50K /
2 Page |
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it Online |
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Part No. |
D4126
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OCR Text |
...g details 60 9 + 9 3.33 88 34 3.5 1.3 0.85 1.9 d4010 dish: 70mm x 1mm 2.8" x 0.04" (2) pads, uncompressed 2mm/0.08" each thick ...90mm x 1mm 3.6" x 0.04" (2) pads, uncompressed 2mm/0.08" each thick bolt m6 x 50mm 160 22 + 22 3... |
Description |
POWER TRANSFORMER, 100 VA
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File Size |
110.98K /
4 Page |
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it Online |
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Price and Availability
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