HYW-5343-X3-NNN-05 pdf Datasheet P15 Part Num --- IC-ON-LINE


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HYW-5343-X3-NNN-05 Datasheet PDF File

For HYW-5343-X3-NNN-05 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

					Samsung semiconductor
Part No.	CL21A475KPFNNNE
Description	SPECIFICATION
File Size	78.51K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68653-430HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					MagnaChip Semiconductor...
Part No.	CL10B105KO8NNNC
Description	11-Channel Level Shifter with Gate Voltage Shaping and Discharge Functions
File Size	335.74K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68653-431HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	CL31B474KBHNNNE
Description	CAP, 470? 50V, ±10%, X7R, 1206
File Size	134.46K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	380-5343-20W
Description	Receptacle,INFINX,6 Pair 14 Position 12MM,100MΩ, w/lossy
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	CL10A106MP8NNNC
Description	SPECIFICATION
File Size	142.41K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68653-433HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	CL10C2R2BB8NNNC
Description	SPECIFICATION
File Size	79.40K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-825343350LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	CL21B224KBFNNNG
Description	CAP, 220? 50V, ±10%, X7R, 0805
File Size	134.38K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68653-434HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	CL21B102KBANNNC
Description	Multi Layer Ceramic Capacitor (MLCC)
File Size	74.06K / 1 Page	View it Online	Download Datasheet

					Samsung semiconductor
Part No.	CL03A104KO3NNNC
Description	Samsung electro-mechanics
File Size	78.56K / 2 Page	View it Online	Download Datasheet

					Samsung semiconductor
Part No.	CL21B105KBFNNNF
Description	SPECIFICATION
File Size	134.34K / 2 Page	View it Online	Download Datasheet

					Samsung Electronics
Part No.	CL10F474ZB8NNNC
Description	Multi-layer Ceramic Capacitor
File Size	78.07K / 2 Page	View it Online	Download Datasheet

For HYW-5343-X3-NNN-05 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

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