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Amphenol Communications Solutions |
| Part No. |
130-3142-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1132 0901361132
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
130-3182-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361109 90136-1109
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 9 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 9 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
130-3162-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361108 90136-1108
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.33K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
130-3142-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361107 90136-1107
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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|
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Amphenol Communications Solutions |
| Part No. |
130-3162-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3142-15H
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| Description |
Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, APP
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361106 90136-1106
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
130-3182-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3142-15D
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| Description |
Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3182-15H
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| Description |
Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3162-15D
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| Description |
Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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