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Amphenol Communications Solutions |
Part No. |
10136644-0322LF
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Description |
Minitek® Pwr 4.2 , Single Row, Receptacle Housing, 3 Positions, Non GW Compatible Nylon66, Black Color.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10136644-0311LF
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Description |
Minitek® Pwr 4.2 , Single Row, Receptacle Housing, 3 Positions, GW Compatible Nylon66, Natural Color.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68764-403HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87606-440LF
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Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 80 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
61083-064409LF
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Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 60 Positions.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68764-406HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0713086474
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Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130) 2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
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File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68764-404HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0713086470
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Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130) 2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30
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File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
61083-164402LF
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Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10069525-164402LF
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Description |
Bergstak® 0.80mm Pitch, Board to Board, Vertical, Plug Assembly, 160 Positions, Dual Row.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-408HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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