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  1851 Datasheet PDF File

For 1851 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    TS1851 TS1851AI TS1851I TS1852 TS1852AI TS1852I TS1854 TS1854AI TS1854I

ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
意法半导
Part No. TS1851 TS1851AI TS1851I TS1852 TS1852AI TS1852I TS1854 TS1854AI TS1854I
Description 1.8V INPUT/OUTPUT RAIL TO RAIL LOW POWER OPERATIONAL AMPLIFIERS

File Size 169.85K  /  17 Page

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Amphenol Communications Solutions

Part No. 87185-127HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Renesas
Part No. HM62G18512ABP-30 HM62G18512ABP-33
Description Memory>Fast SRAM>Late Write / High Speed Interface Synchronous SRAM

File Size 163.78K  /  25 Page

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Amphenol Communications Solutions

Part No. 87185-104HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    Renesas Technology / Hitachi Semiconductor
Part No. HM66WP18513BP-65
Description 9M Flow Through Zero Bus Latency (ZBL) SRAM

File Size 272.62K  /  31 Page

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Amphenol Communications Solutions

Part No. 87185-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    SF0070CF51851T

Integrated Circuit Systems
ICS
Part No. SF0070CF51851T
Description 70 MHz SAW Bandpass Filter 26 MHz bandwidth
High Selectivity SAW Filters

File Size 107.17K  /  2 Page

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Amphenol Communications Solutions

Part No. 87185-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    Cypress Semiconductor, Corp.
Part No. CYM1851V33P8-15C CYM1851V33PN-25C CYM1851V33PN-35C CYM1851V33PM-15C
Description 1,024K x 32 3.3V Static RAM Module
1M X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 ANGLED, PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA72 ANGLED, PLASTIC, SIMM-72
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72

File Size 255.95K  /  9 Page

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Amphenol Communications Solutions

Part No. 10110818-5100HFLF
Description SFP+ Cable Assembly, 24 AWG, 10.0 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    SICK AG
Part No. LFV230-XXSNBTPM0400 6041851
Description LEVEL SENSORS

File Size 192.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    CDP1851 CDP1851C CDP1851CD CDP1851CDX CDP1851CE CDP1851CEX CDP1851DX CDP1851E FN1056

INTERSIL[Intersil Corporation]
Intersil, Corp.
Part No. CDP1851 CDP1851C CDP1851CD CDP1851CDX CDP1851CE CDP1851CEX CDP1851DX CDP1851E FN1056
Description    CMOS Programmable I/O Interface
From old datasheet system
CMOS Programmable I/O Interface(CMOS 可编程I/O接口) CMOS可编程I / O接口的CMOS(可编程的I / O接口
CMOS Programmable I/O Interface(CMOS ???绋?/O?ュ?)

File Size 55.99K  /  14 Page

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Amphenol Communications Solutions

Part No. 87185-103HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    RCLAMP1851ZA RCLAMP1851ZATFT

Semtech Corporation
Part No. RCLAMP1851ZA RCLAMP1851ZATFT
Description Ultra Small RClamp 1-Line, 18V ESD Protection

File Size 584.40K  /  7 Page

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Amphenol Communications Solutions

Part No. 87185-131HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    LINER[Linear Technology]
Part No. LTC1850CFW LTC1851CFW LTC1850 LTC1850IFW LTC1851IFW
Description 8-Channel, 10-Bit/12-Bit, 1.25Msps Sampling ADCs
8-Channel 10-Bit/12-Bit 1.25Msps Sampling ADCs

File Size 281.12K  /  28 Page

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Amphenol Communications Solutions

Part No. 67118-518LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Double Row, 36 position, 2.54mm (.100in) Pitch.
Tech specs    

Official Product Page

    IRS21851STRPBF IRS21851SPBF

International Rectifier
Part No. IRS21851STRPBF IRS21851SPBF
Description SINGLE HIGH SIDE DRIVER IC

File Size 393.32K  /  16 Page

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Amphenol Communications Solutions

Part No. 87185-121HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

For 1851 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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