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7519Z B8279 TIPL765A 15KP200 C451G 4N4ST 25C64 CY7B9911
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    RMPA0963

Fairchild Semiconductor
Part No. RMPA0963
OCR Text ...is device depends on a reliable void-free attachment of the heatsink to the pwb. the solder joint should be 95% void-free and be a consistent thickness.  rework considerations: rework of a device attached to a board is limited to reflow of...
Description Cellular CDMA CDMA2000-1X and WCDMA Power Amplifier Module

File Size 145.31K  /  7 Page

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    Wurth Elektronik GmbH &...
Part No. 74479875210C
OCR Text ...cification, otherwise this will void the warranty. ? all products shall be used before the end of the period of 12 months based on the product date code, if not a 100% solderability cant be ensured. ? violation of the technical product spec...
Description    WE-PMI Power Multilayer Inductor

File Size 296.21K  /  6 Page

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    Wurth Elektronik GmbH &...
Part No. 74479875222C
OCR Text ...cification, otherwise this will void the warranty. ? all products shall be used before the end of the period of 12 months based on the product date code, if not a 100% solderability cant be ensured. ? violation of the technical product spec...
Description    WE-PMI Power Multilayer Inductor

File Size 295.66K  /  6 Page

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    Wurth Elektronik GmbH &...
Part No. 7447732168
OCR Text ...cification, otherwise this will void thewarranty. ? all products shall be used before the end of the period of 12 months based on the product date code, if not a 100% solderability cant be ensured. ? violation of the technical product speci...
Description    WE-PD2 SMD Power Inductor

File Size 494.25K  /  6 Page

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    Mallory performance clu...
Part No. PN8200
OCR Text ...inal purchase. this warranty is void for any products purchased through auction websites. if found to be defective as mentioned above, it w...free of charge using ground shipping methods. this shall constitute the sole remedy of the purcha...
Description    MSD Blaster Coil

File Size 228.77K  /  2 Page

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    Mallory performance clu...
Part No. PN79082 PN79083
OCR Text ...inal purchase. this warranty is void for any products purchased through auction websites. if found to be defective as mentioned above, it w...free of charge using ground shipping methods. this shall constitute the sole remedy of the purcha...
Description    MSD Pro Mag 12 LT Chevrolet

File Size 947.15K  /  4 Page

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    0702871202

Molex Electronics Ltd.
Part No. 0702871202
OCR Text ... PACKAGING BULK - PK-70873-0353 VOID PIN LOCATION ROW LOCATION A 2, 3 B 2, 3 CKTS 10 MATERIAL NUMBER 70287-1294 REV: ECR/ECN INFORMATION EC No: DATE: TITLE: A UCP2010-0011 3/2/2010 MKIPPER SALES ASS'Y - HIGH TEMP. DU...
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 16 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 16 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)

File Size 308.51K  /  6 Page

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    Mallory performance clu...
Part No. 8870
OCR Text ...inal purchase. this warranty is void for any products purchased through auction websites. if found to be defective as mentioned above, it w...free of charge using ground shipping methods. this shall constitute the sole remedy of the purcha...
Description MSD DIS Coil Interface Module
   MSD DIS Coil Interface Module

File Size 275.67K  /  4 Page

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    RMPA1966

Fairchild Semiconductor
Part No. RMPA1966
OCR Text ...is device depends on a reliable void-free attachment of the heat sink to the PWB. The solder joint should be 95% void-free and be a consistent thickness. Rework Considerations: Rework of a device attached to a board is limited to reflow of ...
Description RMPA1966 I-Lo TM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
RMPA1966 I-Lo TM WCDMA Band II Power Amplifier Module, 1850-1910 MHz

File Size 504.07K  /  7 Page

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    RMPA196607 RMPA1966

FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA196607 RMPA1966
OCR Text ...is device depends on a reliable void-free attachment of the heat sink to the PWB. The solder joint should be 95% void-free and be a consistent thickness. Rework Considerations: Rework of a device attached to a board is limited to reflow of ...
Description WCDMA Band II Power Amplifier Module

File Size 181.70K  /  7 Page

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