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Molex Electronics Ltd.
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| Part No. |
A-70567-0341 15-80-1061 0015801061
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| Description |
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
 View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
A-70567-0343 15-80-1101 0015801101
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| Description |
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.38K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0015800163 15-80-0163
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| Description |
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
1,218.30K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
A-70567-0344 15-80-1121 0015801121
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| Description |
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0015800165 15-80-0165 70567-0142 A-70567-0142
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| Description |
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,
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| File Size |
1,218.25K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
15-80-0585 0015800585
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| Description |
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
1,218.25K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
A-70567-0346 15-80-1161 0015801161
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| Description |
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
87891-4006
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| Description |
2.54mm (.100) Pitch KK庐 header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
87891-0606
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| Description |
2.54mm (.100) Pitch KK庐 header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
87891-0306
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| Description |
2.54mm (.100) Pitch KK庐 header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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