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  RSX501LA-2009 Datasheet PDF File

For RSX501LA-2009 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    2SK200907 2SK2009

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Toshiba Semiconductor
Part No. 2SK200907 2SK2009
Description N CHANNEL MOS TYPE (HIGH SPEED SWITCHING, ANALOG SWITCH APPLICATIONS)

File Size 517.38K  /  5 Page

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Amphenol Communications Solutions

Part No. 67292-009
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 18 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    FQD4N2009

Fairchild Semiconductor
Part No. FQD4N2009
Description 200V N-Channel MOSFET

File Size 772.02K  /  9 Page

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Amphenol Communications Solutions

Part No. 10121002-009LF
Description HPCE R/A Receptacle 16P12S
Tech specs    

Official Product Page

    NAIS
Part No. AMP1009 AMP2009
Description (AMPxx09) Motion Detecting Sensor

File Size 620.53K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-807200950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    COSMO[COSMO Electronics Corporation]
Part No. S1A120099
Description Reed Relay

File Size 132.00K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-106200950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    COSMO[COSMO Electronics Corporation]
Part No. S1A120098
Description Reed Relay

File Size 137.57K  /  1 Page

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Amphenol Communications Solutions

Part No. 10142632-009LF
Description Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Receptacle, 9 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    2SK112009

Toshiba Semiconductor
Part No. 2SK112009
Description DC−DC Converter and Motor Drive Applications

File Size 406.85K  /  6 Page

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Amphenol Communications Solutions

Part No. 73932-2009LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 3 Mod
Tech specs    

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    Bourns
Part No. CVH252009
Description Multilayer Power Chip Inductors

File Size 407.18K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-142009LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

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    744052009

Wurth Elektronik GmbH & Co. KG, Germany.
Part No. 744052009
Description POWER-CHOKE WE-TPC

File Size 91.63K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-T40-20-090LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 40 Positions.
Tech specs    

Official Product Page

    UPG2009TB UPG2009TB-E3

NEC Corp.
NEC[NEC]
Part No. UPG2009TB UPG2009TB-E3
Description NECs L S-BAND 4W SPDT SWITCH
NECs L, S-BAND 4W SPDT SWITCH
NECs L/ S-BAND 4W SPDT SWITCH

File Size 132.08K  /  8 Page

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Amphenol Communications Solutions

Part No. 10119109-372009LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MD2009DFP

STMicroelectronics
Part No. MD2009DFP
Description Low base drive requirement

File Size 250.32K  /  10 Page

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Amphenol Communications Solutions

Part No. 54242-103200950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For RSX501LA-2009 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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