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    SSESD11B

ON Semiconductor
Part No. SSESD11B
OCR Text ...oard solder pad design based on results of board mount testing, on semiconductor?s recommended mounting pads and solder mask opening are shown in figure 6. maximum acceptable pcb mounting pads and solder mask opening are shown in figure 7. ...
Description Transient Voltage Suppressors

File Size 80.08K  /  6 Page

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Part No. TIC-4000
OCR Text ...s the intended applications and results. we strongly recommend that you carry out your own prior trials to confrm such suitability of our product. a n y l i a b i l i t y i n r e s p e c t o f t h e i n f o r m a t i o n i n t h e ...
Description High Performance Thermal Interface Compound for Copper-Based Heat Sinks

File Size 369.16K  /  2 Page

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Part No. POLYPADK-4
OCR Text ...s the intended applications and results. we strongly recommend that you carry out your own prior trials to confrm such suitability of our product. any liability in respect of the information in the technical data sheet or any other written ...
Description Excellent dielectric and physical strength

File Size 542.81K  /  2 Page

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Part No. POLYPADK-10
OCR Text ...s the intended applications and results. we strongly recommend that you carry out your own prior trials to confrm such suitability of our product. any liability in respect of the information in the technical data sheet or any other written ...
Description Polyester based

File Size 543.80K  /  2 Page

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    Philips
Part No. TDA8552T_TS_3 TDA8552T/N1 TDA8552TS/N1
OCR Text ...ers are switched off. This also results in a reduction of quiescent current consumption. The TDA8552T is contained in a 20-pin small outline package. For the TDA8552TS, which is contained in a 20-pin very small outline package, the maximum ...
Description From old datasheet system
TDA8552T; TDA8552TS; 2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing

File Size 182.75K  /  28 Page

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