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ON Semi
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| Part No. |
TRA2525 MR3025 ON2996
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| OCR Text |
...e dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used depends upon the degree of cleaning to be accomplished and is a function of the metal involved. These flu... |
| Description |
ORDERING INFORMATION
From old datasheet system
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| File Size |
121.02K /
8 Page |
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it Online |
Download Datasheet
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Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
美国讯泰微波有限公司上海代表
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| Part No. |
HMC361
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| OCR Text |
...ic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool temperature of 265 C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 C. DO NOT expose the chip t... |
| Description |
GaAs HBT MMIC DIVIDE-BY-2, DC - 11.0 GHz
From old datasheet system
Prescaler
600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
GaAs HBT MMIC DIVIDE-BY-2/ DC - 11.0 GHz
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| File Size |
197.79K /
6 Page |
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it Online |
Download Datasheet |
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ON Semi
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| Part No. |
TRA2532 ON2997
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| OCR Text |
...e dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used depends upon the degree of cleaning to be accomplished and is a function of the metal involved. These flu... |
| Description |
CASE 193
From old datasheet system
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| File Size |
100.51K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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