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  molding Datasheet PDF File

For molding Found Datasheets File :: 144+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    DB102

Leshan Radio Company
Part No. DB102
Description    High Current Glass Passivated molding Single-Phase Bridge Rectifier

File Size 174.13K  /  3 Page

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Part No. HM514270ALJ-7 HM514270ALZ-7 HM514270ALZ-8 HM51S4270ALJ-7 HM51S4270ALRR-7 HM51S4270ALTT-7 HM51S4270ARR-7 HM51S4270ARR-8 HM514270AZ-7
Description x16 Fast Page Mode DRAM
Plastic internal molding, Noise prevention, Small and lightweight interface; HRS No: 112-3372-0 71; Contact Mating Area Plating: Tin

File Size 625.91K  /  25 Page

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    WNC WNB2R0FE WNBR25FE WHB250FE WNCR25FE WNCR75FE WNCR10FE WHC750FE WHER10FE WHER50FE WHE100FE WHE10KFE WHE10RFE WHE15RFE

Ohmite Mfg. Co.
Part No. WNC WNB2R0FE WNBR25FE WHB250FE WNCR25FE WNCR75FE WNCR10FE WHC750FE WHER10FE WHER50FE WHE100FE WHE10KFE WHE10RFE WHE15RFE WHE1K0FE WHE1R0FE WHE250FE WHE25KFE WHE5R0FE WHE5K0FE WHE560FE WHA200FE WNC100FE
Description Miniature Molded Wirewound
   Encapsulated by epoxy molding compound

File Size 256.97K  /  2 Page

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    Hitachi,Ltd.
Part No. HM51W17805B HM51W17805BJ-8 HM51W17805BLJ-8 HM51W17805BS-8 HM51W17805BLS-8 HM51W17805BLTT-8 HM51W17805BTT-8 HM51W17805BLTS-8 HM51W17805BTS-8
Description Plastic internal molding, Noise prevention, Small and lightweight interface; HRS No: 112-3355-0 71; Contact Mating Area Plating: Tin
2097152-word*8-bit Dynamic random access memory

File Size 745.13K  /  31 Page

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    FMG2G100US60

Fairchild Semiconductor
Part No. FMG2G100US60
Description    molding Type Module
IGBT

File Size 634.46K  /  9 Page

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    FMG2G150US60E

Fairchild Semiconductor
Part No. FMG2G150US60E
Description    molding Type Module
IGBT

File Size 639.90K  /  9 Page

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    Cinch Connectors
Part No. HM514265DLJ-5 HM514265DLJ-7 HM514265DJ-6R HM514265DJ-8 HM514265DJ-7 HM514265DJ-5 HM51S4265DLJ-6R HM514265DLJ-6R HM514265DTT-6R HM514265DLTT-6R HM51S4265DLTT-5
Description x16 EDO Page Mode DRAM
Plastic internal molding, Noise prevention, Small and lightweight interface; HRS No: 112-0076-0 71; Contact Mating Area Plating: Tin x16 EDO公司页面模式的DRAM

File Size 1,428.55K  /  33 Page

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    FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. FMBL1G300US60
Description IGBT
molding Type Module
BK Precision Sweep/Function Generators, Waveforms: Sine, Square, Triangle, /- Pulse, /- Ramp, Frequency Range: .2 Hz-20 MHz, Resolution: 5 Digits, Tuning Range: 10:1, Impedance: 50 Ohm, Attenuation: -20 /-1 dB

File Size 691.70K  /  9 Page

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    FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. FM2G300US60
Description IGBT
molding Type Module
Sweep Function Generator; Bandwidth Max:12MHz; Frequency Max:12MHz; Frequency Min:0.1Hz; Waveforms:Sine, Square, Triangle, Ramp, Pulse RoHS Compliant: NA

File Size 694.15K  /  9 Page

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    FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. FMBL1G200US60
Description IGBT
molding Type Module
10MHz DDS Sweep Function Generator; Bandwidth Max:10MHz; Sweep Rate Range:100:1 lin/log; Sweep Time Range:10 mSec to 30 Sec; Frequency Max:10MHz; Frequency Min:0.01Hz RoHS Compliant: NA

File Size 698.50K  /  9 Page

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For molding Found Datasheets File :: 144+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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