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  HYW-5343-X3-NNN-05 Datasheet PDF File

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    CD54AC5343A CD54ACT5343A

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INTERSIL[Intersil Corporation]
Part No. CD54AC5343A CD54ACT5343A
Description Octal D-Type Flip-Flop, Three-State Positive-Edge Triggered, Inverting

File Size 9.69K  /  1 Page

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Amphenol Communications Solutions

Part No. 68653-430HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    INTERSIL[Intersil Corporation]
Part No. HUF75343S3S HUF75343P3 HUF75343G3 FN4352
Description 75A, 55V, 0.009 Ohm, N-Channel UltraFET Power MOSFETs(75A, 55V, 0.009 Ω, N沟道UltraFET功率MOS场效应管)
From old datasheet system
75A/ 55V/ 0.009 Ohm/ N-Channel UltraFET Power MOSFETs

File Size 98.37K  /  9 Page

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Amphenol Communications Solutions

Part No. 68653-431HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

    L2SC5343SLT1G L2SC5343SLT3G

Leshan Radio Company
Part No. L2SC5343SLT1G L2SC5343SLT3G
Description General Purpose Transistors NPN Silicon

File Size 341.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 380-5343-20W
Description Receptacle,INFINX,6 Pair 14 Position 12MM,100MΩ, w/lossy
Tech specs    

Official Product Page

    CL21C150JCANNNC

Samsung semiconductor
Part No. CL21C150JCANNNC
Description CAP, 15? 100V, ±5%, C0G, 0805

File Size 77.64K  /  2 Page

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Amphenol Communications Solutions

Part No. 68653-433HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

    CL10B102KB8NNNC

Samsung semiconductor
Part No. CL10B102KB8NNNC
Description SPECIFICATION

File Size 78.32K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-825343350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CL21A226MQQNNNE

Samsung semiconductor
Part No. CL21A226MQQNNNE
Description SPECIFICATION

File Size 134.15K  /  2 Page

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Amphenol Communications Solutions

Part No. 68653-434HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs    

Official Product Page

    CL10B105KA8NNNC

Samsung semiconductor
Part No. CL10B105KA8NNNC
Description Multi Layer Ceramic Capacitor (MLCC)

File Size 88.78K  /  1 Page

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    CL31A106KAHNNNE

Samsung semiconductor
Part No. CL31A106KAHNNNE
Description SPECIFICATION

File Size 134.37K  /  2 Page

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    CL05C3R3CB5NNNC

Samsung semiconductor
Part No. CL05C3R3CB5NNNC
Description SPECIFICATION

File Size 77.35K  /  2 Page

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    CL21A106KPFNNNE

Samsung semiconductor
Part No. CL21A106KPFNNNE
Description Multi-layer Ceramic Capacitor

File Size 134.56K  /  2 Page

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