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For bondable Found Datasheets File :: 291 Search Time::1.922ms
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				Semikron International
Part No.	SKR22
OCR Text	... 2 area total 501.76 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package tray chips / package 9pcs skr 22,4 qu bond 2 rev. 1 ? 19.02.2010 ? by semikron this is an electrostatic discharge sensitive ...
Description	DIODE
File Size	66.30K / 2 Page	View it Online	Download Datasheet

				Vishay
Part No.	SABC
OCR Text	...sfer@vishay.com current sensing bondable chip resistors features ? low ohmic value down to 0.05 ? ? tolerance down to 1% ? stability ? low noise ? low tcr this thin film chip resistor fits applications as force balance s...
Description	Current Sensing bondable Chip Resistors
File Size	90.61K / 1 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD04C060IHD10
OCR Text	... 2 mm 2 area total 4 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 2661 (5" wafer) pcs skcd 04 c 060 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrost...
Description	CAL-DIODE
File Size	57.27K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD06C060I310
OCR Text	...mm 2 area total 5.95 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 1720 (5" wafer) pcs skcd 06 c 060 i3 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostati...
Description	CAL-DIODE
File Size	104.77K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD06C060IHD10
OCR Text	...mm 2 area total 5.95 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 1777 (5" wafer) pcs skcd 06 c 060 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrost...
Description	CAL-DIODE
File Size	60.59K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD06C120IHD10
OCR Text	...mm 2 area total 5.95 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 1720 (5" wafer) pcs skcd 06 c 120 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrost...
Description	CAL-DIODE
File Size	111.57K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD09C060I310
OCR Text	...mm 2 area total 8.70 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 1171 (5" wafer) pcs skcd 09 c 060 i3 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostati...
Description	CAL-DIODE
File Size	89.10K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKT12
OCR Text	...rable (ag/ni) gate and cathode bondable (al) wire bond al,diameter 500m package tray chips / package 36 pcs skt 12,4 qu rg bond. 2 rev. 0 ? 19.02.2010 ? by semikron this is an electrostatic discharge sensitive device (esds), interna...
Description	THYRISTOR
File Size	77.97K / 2 Page	View it Online	Download Datasheet

				http://
Part No.	MS8250-48
OCR Text	...(0.09 pf) available as bondable chips priced for commercial applications specifications @ 25c v f (1 ma): 0.39 v max. v b (10 ? a): 3 v min. i r (1 v): 100 na max. r s (1...
Description	SCHOTTKY DIODES TM Silicon Low Barrier
File Size	114.64K / 2 Page	View it Online	Download Datasheet

				Vishay Intertechnology, Inc.
Part No.	HPC0402B4R3CWYW HPC0402B4R3BGYW HPC0402B4R3BWYW HPC0402B4R7CGYW HPC0402B4R7BWYW HPC0402B1R2CGYW HPC0402B1R2BGYW HPC0402B1R3BWYW HPC0402B6R2BWYW HPC0402B3R0CGYW HPC0402B3R3BGYW HPC0402B3R6BWYW HPC0402B2R0BGYW HPC0402B1R2CWYW HPC0402B1R3CGYW HPC0402B3R3CGYW HPC0402B1R3CWYW HPC0402B3R3CWYW HPC0402B4R7CWYW HPC0402B6R8CGYW HPC0402B3R6CWYW HPC0402B6R2CWYW HPC0402B6R2BGYW HPC0402B6R2CGYW HPC0402B4R7BGYW HPC0402B6R8CWYW HPC0402B6R8BGYW HPC0402B1R0BWYW HPC0402B3R0BWYW HPC0402B1R0CWYW HPC0402B3R3BWYW HPC0402B1R0BGYW HPC0402B1R0CGYW HPC0402B1R2BWYW HPC0402B1R3BGYW HPC0402B3R0BGYW HPC0402B6R8BWYW HPC0402B3R6BGYW HPC0402B4R3CGYW HPC0402B3R6CGYW HPC0402B2R0BWYW HPC0402B3R0CWYW
OCR Text	bondable 0402 capacitor for smartcard, high-frequency and substrate-embedded applications hpc0402b/c vishay www.vishay.com for technical questi ons, contact: siliconrfcap@vishay.com document number: 10120 16 revision: 16-dec-08 not for ne...
Description	CAPACITOR, CERAMIC, 16 V, 0.0000043 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.0000047 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.0000012 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.0000013 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.0000062 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.000003 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.0000033 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.0000036 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.000002 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.0000068 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, 16 V, 0.000001 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
File Size	129.54K / 3 Page	View it Online	Download Datasheet

For bondable Found Datasheets File :: 291 Search Time::1.922ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

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