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  90136-1303 Datasheet PDF File

For 90136-1303 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0901361102 90136-1102

Molex Electronics Ltd.
Part No. 0901361102 90136-1102
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901361103 90136-1103

Molex Electronics Ltd.
Part No. 0901361103 90136-1103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3182-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    0901361104 90136-1104

Molex Electronics Ltd.
Part No. 0901361104 90136-1104
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3162-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    0901361105 90136-1105

Molex Electronics Ltd.
Part No. 0901361105 90136-1105
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3142-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    90136-2304 0901362304

Molex Electronics Ltd.
Part No. 90136-2304 0901362304
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 130-3162-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    90136-1203 0901361203

Molex Electronics Ltd.
Part No. 90136-1203 0901361203
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3142-15H
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    0901362330 90136-2330

Molex Electronics Ltd.
Part No. 0901362330 90136-2330
Description 2.54mm (.100) Pitch C-Grid III?Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 130-3182-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901362332 90136-2332

Molex Electronics Ltd.
Part No. 0901362332 90136-2332
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 130-3142-15D
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    90136-2305 0901362305

Molex Electronics Ltd.
Part No. 90136-2305 0901362305
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

View it Online

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Amphenol Communications Solutions

Part No. 130-3182-15H
Description Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    90136-1207 0901361207

Molex Electronics Ltd.
http://
Part No. 90136-1207 0901361207
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3162-15D
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

For 90136-1303 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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