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  5208-4CC Datasheet PDF File

For 5208-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    IRG4CC77KB

International Rectifier
Part No. IRG4CC77KB
Description IRG4CC77KB IGBT Die in Wafer Form
File Size 39.14K  /  1 Page

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Amphenol Communications Solutions
Part No. 52088-203LF
Description Sofix ® - Header kit - Signal - 2x4 - PIP
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    IRG4CC71KB

International Rectifier
Part No. IRG4CC71KB
Description IRG4CC71KB IGBT Die in Wafer Form
File Size 37.81K  /  1 Page

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Amphenol Communications Solutions
Part No. 52089-203LF
Description SOFIX® Power Connectors, Power Connectors, Shielded I/O Header 2x4-PIP .
Tech specs 　 　

Official Product Page

    IRG4CC70UB

International Rectifier
Part No. IRG4CC70UB
Description IRG4CC70UB IGBT Die in Wafer Form
File Size 34.36K  /  1 Page

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Amphenol Communications Solutions
Part No. 52088-201LF
Description Sofix ® - Header kit - Signal - 2x4 - PIP
Tech specs 　 　

Official Product Page

    IRG4CC60UB

International Rectifier
Part No. IRG4CC60UB
Description IRG4CC60UB IGBT Die in Wafer Form
File Size 27.20K  /  1 Page

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Amphenol Communications Solutions
Part No. 98424-G52-08ULF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Surface Mount, Double Row, 8 Position ,2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    IRG4CC60FB

International Rectifier
Part No. IRG4CC60FB
Description IRG4CC60FB IGBT Die in Wafer Form
File Size 27.19K  /  1 Page

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Amphenol Communications Solutions
Part No. 98424-S52-08ULF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Surface Mount, Double Row, 8 Position ,2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    IRG4CC58KB

International Rectifier
Part No. IRG4CC58KB
Description IRG4CC58KB IGBT Die in Wafer Form
File Size 40.45K  /  1 Page

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Amphenol Communications Solutions
Part No. 57202-S52-08ALF
Description Unshrouded Vertical Header, Surface Mount, Double Row, 16 Position ,2.00mm (0.079in) Pitch
Tech specs 　 　

Official Product Page

    IRG4CC50WB

Hittite Microwave Corporation
International Rectifier
Part No. IRG4CC50WB
Description IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
File Size 23.15K  /  1 Page

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Amphenol Communications Solutions
Part No. 98424-F52-08ULF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Surface Mount, Double Row, 8 Position ,2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    IRG4CC50UB

International Rectifier
Part No. IRG4CC50UB
Description IRG4CC50UB IGBT Die in Wafer Form
File Size 35.08K  /  1 Page

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Amphenol Communications Solutions
Part No. 68025-208HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    IRG4CC50SB

International Rectifier
Part No. IRG4CC50SB
Description IRG4CC50SB IGBT Die in Wafer Form
File Size 38.93K  /  1 Page

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Amphenol Communications Solutions
Part No. 77313-152-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs 　 　

Official Product Page

    IRG4CC50KB

International Rectifier
Part No. IRG4CC50KB
Description IRG4CC50KB IGBT Die in Wafer Form
File Size 36.59K  /  1 Page

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Amphenol Communications Solutions
Part No. 57202-G52-08ULF
Description Unshrouded Vertical Header, Surface Mount, Double Row, 16 Position ,2.00mm (0.079in) Pitch
Tech specs 　 　

Official Product Page

For 5208-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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