| |
|
 |
Motorola Mobility Holdings, Inc.
|
| Part No. |
MPC7410HX400LE
|
| Description |
32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
|
| File Size |
678.38K /
52 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Motorola Mobility Holdings, Inc.
|
| Part No. |
MPC603PFE220LX MPC603PFE240LX MPC603PFE233LX MPC603PFE180LX MPC603PFE200LX MPC603PFE166LX MPC603PFE160LX
|
| Description |
32-BIT, 220 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 240 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 233 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 180 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 200 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 166 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 160 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
| File Size |
165.40K /
40 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
