0438 pdf Datasheet P14 Part Num --- IC-ON-LINE


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0438 Datasheet PDF File

For 0438 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

					Samsung semiconductor
Part No.	K4H510438G-LC/LB0 K4H510438G-LC/LB3 K4H510838G-LC/LB3 K4H511638G-LC/LB3 K4H510838G-LC/LCC K4H511638G-LC/LCC
Description	512Mb G-die DDR SDRAM Specification
File Size	351.41K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10043857-202LF
Description	400 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung semiconductor
Part No.	K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description	256Mb J-die DDR SDRAM Specification
File Size	352.76K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	51940-438LF
Description	PwrBlade®, Power Supply Connectors, 8P 44S 8P Vertical Receptacle.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4H511638F-LC/LCC K4H510438F-LC/LB3 K4H510838F-LC/LCC K4H510838F-LC/LB3 K4H511638F-LC/LB3 K4H510438F-LC/LB0
Description	512Mb F-die DDR SDRAM Specification
File Size	354.41K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68690-438HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H510438C-ZCCC K4H510438C-ZLB3 K4H510438C-ZLCC K4H510438C-ZCB3 K4H511638C-ZLCC K4H510838C-ZCB3 K4H510838C-ZCCC K4H510838C-ZLB3 K4H510838C-ZLCC K4H511638C-Z K4H511638C-ZCB3 K4H511638C-ZCCC K4H511638C-ZLB3
Description	512MB C-DIE DDR SDRAM SPECIFICATION
File Size	379.18K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87900-438HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

					http:// Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H510838C-ZCCC K4H510438C-ZCCC K4H510838C-ZCB3 K4H511638C-ZCB3 K4H510438C-ZCB3 K4H510438C-ZLB3 K4H511638C-ZLB3 K4H510838C-ZLCC K4H511638C-ZLCC K4H510838C-ZLB3 K4H510438C-ZLCC
Description	512Mb C-die DDR SDRAM Specification 荤的512Mb芯片DDR SDRAM内存规格 CAP 0.01UF 1000V 10% X7R SMD-1812 TR-13 FLEXITERM
File Size	383.91K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144517-043802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Receptacle.
Tech specs				Official Product Page

					http:// Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H560438D-GCA2 K4H561638D-GLB3 K4H560838D-GLB3 K4H561638D-GCA2 K4H561638D-GLB0 K4H560438D-GLB0 K4H560438D-GLB3 K4H560838D-GLB0 K4H560838D-GCB3 K4H560838D-GCA2 K4H561638D-GLA2
Description	DIODE ZENER SINGLE 200mW 33Vz 0.05mA-Izt 0.05 0.05uA-Ir 25 SOD-323 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 500mW 28Vz 0.05mA-Izt 0.05 0.05uA-Ir 21.2 SOD-123 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 200mW 30Vz 0.05mA-Izt 0.05 0.05uA-Ir 22.8 SOD-323 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 500mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-123 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 150mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-523 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 150mW 33Vz 0.05mA-Izt 0.05 0.05uA-Ir 25 SOD-523 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 200mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-323 3K/REEL DIODE ZENER SINGLE 200mW 28Vz 0.05mA-Izt 0.05 0.05uA-Ir 21.2 SOD-323 3K/REEL DIODE ZENER SINGLE 500mW 39Vz 0.05mA-Izt 0.05 0.05uA-Ir 29.6 SOD-123 3K/REEL DIODE ZENER SINGLE 200mW 39Vz 0.05mA-Izt 0.05 0.05uA-Ir 29.6 SOD-323 3K/REEL
File Size	293.31K / 26 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-804-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4H510438D-UC/LA2 K4H510838D-UC/LA2 K4H511638D-UC/LB0 K4H510838D-UC/LCC K4H511638D-UC/LCC K4H510838D-UC/LB0 K4H510438D-UC/LB0 K4H511638D-UC/LA2 K4H510838D-UC/LB3 K4H511638D-UC/LB3
Description	512Mb D-die DDR SDRAM Specification
File Size	361.82K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10043857-202
Description	400 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H561638D-TC_LB0 K4H560838D-TC_LA0 K4H560838D-TC_LA2 K4H560838D-TC_LB3 K4H560838D-TC_LB0 K4H561638D-TC_LA0 K4H561638D-TC_LA2 K4H561638D-TC_LB3 K4H560438D-TC_LB3 K4H560438D-TC K4H560438D-TC_LA0 K4H560438D-TC_LA2 K4H560438D-TC_LB0 K4H561638D-TC/LA2 K4H561638D-TC/LB0 K4H561638D-TC/LA0 K4H561638D-TC/LB3
Description	256MB
File Size	233.83K / 25 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-404-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

					Atmel, Corp. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H560838H-UC/LCC K4H561638H-UC/LCC K4H560438H-UC/LA2 K4H560838H-UC/LA2 K4H561638H-UC/LA2 K4H560438H-UC/LB0 K4H561638H-UC/LB0 K4H560838H-UC/LB3 K4H561638H-UC/LB3 K4H560838H-UC/LB0 K4H560438H-UCA20 K4H560838H-UCA20 K4H560838H-UCB30
Description	32M X 8 DDR DRAM, 0.7 ns, PDSO66 ROHS COMPLIANT, TSOP2-66 32M X 8 DDR DRAM, 0.75 ns, PDSO66 ROHS COMPLIANT, TSOP2-66 64M X 4 DDR DRAM, 0.75 ns, PDSO66 ROHS COMPLIANT, TSOP2-66 256Mb H-die DDR SDRAM Specification
File Size	361.04K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68020-438HLF
Description	BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 38 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H561638D-GCB0 K4H561638D-GLB0 K4H561638D-GLB3 K4H560838D-GCB0 K4H560838D-GCB3 K4H560838D-GLA2 K4H560838D-GLB0 K4H560838D-GCA2 K4H560838D-GLB3 K4H561638D-GCA2 K4H561638D-GCB3 K4H561638D-GLA2 K4H560438D-GLB3 K4H560438D-GC K4H560438D-GCA2 K4H560438D-GCB0 K4H560438D-GCB3 K4H560438D-GLA2 K4H560438D-GLB0
Description	DDR 256MB
File Size	288.19K / 26 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-104-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

For 0438 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

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