| |
|
 |
Amphenol Communications Solutions |
| Part No. |
54122-116322000LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10145891-1631J13LF
|
| Description |
DDR4 DIMM, Storage and Server Connector, Vertical, Surface Mount, 288 Position, 0.85mm (0.033in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
74741-163LF
|
| Description |
5 Row Signal Header, Straight, STB, Wide body, 1 Mod
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
GSB3116342HR
|
| Description |
USB 3.2, Type A, Receptacle, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 2.4mm, Blue High Temperature Housing, Tray Packaging
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
RJE724881163
|
| Description |
Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
15-80-0063 0015800063
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
| File Size |
1,218.42K /
7 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10106116-3006001LF
|
| Description |
PwrBlade+® , Power Connectors, 3ACP+24S STB, Right Angle, Header.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54112-116342000LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
15-80-0083 0015800083
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
| File Size |
1,218.46K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-116302000RLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
GSB3116346FHR
|
| Description |
USB 3.2, Type A, Receptacle, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 4.4mm, Blue High Temperature Housing, Tray Packaging
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
RJE7B1881163
|
| Description |
Modular Jack - High Performance, Input Output Connectors 8P8C, CAT 6A, RA, Shield, with LEDs.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
