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Molex Electronics Ltd.
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Part No. |
0444322003 44432-2003
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Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, 20 Circuits, with PCB Polarizing Pegs, PA Polyamide Nylon 4/6 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, 20 Circuits, with PCB Polarizing Pegs, PA Polyamide Nylon 4/6
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File Size |
224.15K /
5 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
Part No. |
AFE4432YCHR
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Description |
Ultrasmall, ultra-low-power, high-SNR, integrated AFE for wearable optical biosensing with FIFO 25-DSBGA -40 to 85
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
AFE4432YCHT
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Description |
Ultrasmall, ultra-low-power, high-SNR, integrated AFE for wearable optical biosensing with FIFO 25-DSBGA -40 to 85
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-118HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 18 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
75844-327-20LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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