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| Part No. |
AN-9046
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| OCR Text |
...d and new paste printed with a mini stencil. localized hot air can then be applied to reflow the solder and make the joint. due to the thermal performance of this component, and the typical high performance pwb it will be mounted on,... |
| Description |
Dual Power56 Packaging
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| File Size |
850.15K /
10 Page |
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Download Datasheet
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http://
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| Part No. |
AN-9048
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| OCR Text |
...d and new paste printed with a mini stencil. localized hot air can then be applied to reflow the solder and make the joint. due to the thermal performance of this component, and the typical high performance pwb it will be mounted on,... |
| Description |
6x6 DriverMOS Packaging
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| File Size |
746.79K /
9 Page |
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Data Device, Corp.
DATA DEVICE CORP
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| Part No. |
BU-61588P0-110K BU-61588P0-300S BU-61588P0-150S BU-61588P0-200S BU-61588P0-410S BU-61588P0-290S BU-61588P0-430S BU-61588P0-120S BU-61588P0-190S BU-61588P0-180K BU-61588P0-450S BU-61588P0-390S BU-61588P0-160K BU-61588P0-170K BU-61588P0-100S BU-61588P0-120K BU-61588P0-110S BU-61588P0-170S BU-61588P0-160S BU-61588P0-150K BU-61588P0-400S BU-61588P0-180S BU-61588P0-420S BU-61588P0-100K BU-61588P0-130S BU-61588P0-140K BU-61588P0-140S BU-61588P3-142L BU-61588P3-482Q BU-61588P3-480Q BU-61588P0-130K BU-61588P3-142S BU-61588P3-480K BU-61588P3-482K BU-61588P3-482Z BU-61588P3-142Q BU-61588P3-482Y BU-61588P3-480W BU-61588P3-480S BU-61588P3-480L BU-61588P3-480Z BU-61588P3-482L BU-61588P3-142K BU-61588P3-482W BU-61588P3-482S BU-61588P3-480Y BU-61588F3-152L BU-61588F3-152Q BU-61588G0-120L BU-61588G0-170L BU-61588G0-300L BU-61588G0-110K BU-61588G0-160L BU-61588G0-130L BU-61588G3-440 BU-61588G0-150L BU-61588G0-440K BU-61588G0-110L BU-65178G0-170S BU-65178G3-170S BU-61588G0-120K BU-61588G0-160K BU-65178G0-170Q BU-65178G0-170Y BU-61588G3-142K BU-61588G0-440Z BU-61588G0-170K BU-61588G3-420L BU-61588G0-420L BU-65178G3-170Q BU-61588G3-440L BU-61588G0-140L BU-61588G0-420Y BU-61588G3-420Q BU-65178G0-170L B
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| OCR Text |
mini-ace and bu-61688 mini-ace plus* integrates two 5-volt-only transceivers, protocol, memory management, processor interface logic, and 4k x 16, or 64k x 16* words of ram in a choice of pin grid array (pga), quad flat pack or gull lead p... |
| Description |
2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CPGA81 1 INCH, CERAMIC, PGA-81
2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CPGA81 1 X 1 INCH, LOW PROFILE, CERAMIC, PGA-81
2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP72 1 INCH, CERAMIC, QFP-72
2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP72 1 X 1 INCH, LOW PROFILE, CERAMIC, QFP-72
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| File Size |
142.42K /
12 Page |
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it Online |
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Intel, Corp.
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| Part No. |
80960JA-25 80960JA-33
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...quad flat pack (pqfp) 196-ball mini plastic ball grid array (mpbga) order number: 273159-001 march, 1998 notice: this document contains information on products in the sampling and initial production phases of development. the specificat... |
| Description |
CAP 10UF 10V 20% X7R SMD-1210 TR-7 PLATED-NI/SN 嵌入2位微处理
EMBEDDED 32-BIT MICROPROCESSOR 嵌入2位微处理
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| File Size |
790.75K /
77 Page |
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it Online |
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Fujitsu, Ltd.
FUJITSU LTD
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| Part No. |
FBR18WD06 FBR18WD03-P FBR18ND05-P
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| OCR Text |
... and in a clean atmosphere. the mini- mum switching load varies with the switching frequency and operation environment. 1,500 750 10 700 2,500 1,250 210
3 fbr18 series not for new designs fbr18nd/hd to be discontinied - except fbr18wd mod... |
| Description |
MINIATURE RELAY (SURFACE MOUNT TYPE) 2 POLES-1 to 2 A (FOR SIGNAL SWITCHING) POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.038A (COIL), 6VDC (COIL), 230mW (COIL), 2A (CONTACT), 220VDC (CONTACT), SURFACE MOUNT-STRAIGHT
MINIATURE RELAY (SURFACE MOUNT TYPE) 2 POLES-1 to 2 A (FOR SIGNAL SWITCHING)
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| File Size |
62.48K /
6 Page |
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it Online |
Download Datasheet |
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Price and Availability
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