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Murata Manufacturing Co...
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| Part No. |
GRM31M5C1H393JA01
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| OCR Text |
... material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm (grm02/grm03/grm15: t:0.8mm) copper foil thickness : 0.035mm : solder resist ... |
| Description |
Chip Monolithic Ceramic Capacitor for General
|
| File Size |
631.83K /
30 Page |
 View
it Online |
Download Datasheet
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Murata Manufacturing Co...
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| Part No. |
GRM0335C2A8R8DA01
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| OCR Text |
... material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm (grm02/grm03/grm15: t:0.8mm) copper foil thickness : 0.035mm : solder resist ... |
| Description |
Chip Monolithic Ceramic Capacitor for General
|
| File Size |
603.03K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
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| Part No. |
GRM31M3U1H683JA01
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
618.69K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
|
| Part No. |
GRM31M3U1H104JA01
|
| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
618.46K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
|
| Part No. |
GRM31M2C2A563JA01
|
| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
635.65K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
|
| Part No. |
GRM31M2C2A473JA01
|
| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
618.38K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
|
| Part No. |
GRM31M2C1H563JA01
|
| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
617.62K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
|
| Part No. |
GRM31M2C1H473JA01
|
| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
618.59K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
|
| Part No. |
GRM1885C1H132JA01
|
| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
615.66K /
30 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
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