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  90130-1254 Datasheet PDF File

For 90130-1254 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    90130-1210 0901301210

Molex Electronics Ltd.
Part No. 90130-1210 0901301210
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901301118 90130-1118

Molex Electronics Ltd.
Part No. 0901301118 90130-1118
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 18 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901301116 90130-1116

Molex Electronics Ltd.
Part No. 0901301116 90130-1116
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0901301114 90130-1114

Molex Electronics Ltd.
Part No. 0901301114 90130-1114
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901301112 90130-1112

Molex Electronics Ltd.
Part No. 0901301112 90130-1112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901301110 90130-1110

Molex Electronics Ltd.
Part No. 0901301110 90130-1110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    39-01-3063 0039013063

Molex Electronics Ltd.
Part No. 39-01-3063 0039013063
Description 4.20mm (.165) Pitch Mini-Fit Jr. Plug Housing, Dual Row, without Panel Mount Ears

File Size 228.16K  /  4 Page

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Amphenol Communications Solutions

Part No. 68691-254HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-1150 0901301150

Molex Electronics Ltd.
Part No. 90130-1150 0901301150
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 77317-812-54LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 54 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    0039013085 0039013085-18

Molex Electronics Ltd.
Part No. 0039013085 0039013085-18
Description Mini-Fit Jr. Receptacle Housing, Dual Row, 8 Circuits, UL 94V-2, Black

File Size 22.95K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-125463400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 46 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901303208 90130-3208

Molex Electronics Ltd.
Part No. 0901303208 90130-3208
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 10106125-4006004LF
Description PwrBlade+® , Power Connectors, 2HP+24S+2HP PF, Right Angle, Header.
Tech specs    

Official Product Page

For 90130-1254 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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