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Amphenol Communications Solutions |
| Part No. |
68000-705HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 5 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-112HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-219HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-109HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-220HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-426HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-606H
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-116HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
Infineon
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| Part No. |
Q68000-A8370 CGY50 CGY50E6327
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| Description |
GaAs MMIC (Single-stage monolithic microwave IC MMICamplifier Cascadable 50 Ω gain block)
From old datasheet system
GaAs MMIC (Single-stage monolithic microwave IC MMICamplifier Cascadable 50 ヘ gain block)
GaAs MMIC (Single-stage monolithic microwave IC MMICamplifier Cascadable 50 gain block)
GaAs MMIC (Single-stage monolithic microwave IC MMICamplifier Cascadable 50 gain block)
GaAs MMIC (Single-stage monolithic microwave IC MMICamplifier Cascadable 50 gain block)
Broadband MMIC Amplifier
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| File Size |
34.67K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68000-117
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 17 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-226HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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