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  500817-0705 Datasheet PDF File

For 500817-0705 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0705430117

Molex Electronics Ltd.
Part No. 0705430117
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 13Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-107-05LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0705430114

Molex Electronics Ltd.
Part No. 0705430114
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 10 Circuits, 0.76um

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 66207-051LF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    0705430113

Molex Electronics Ltd.
Part No. 0705430113
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 9Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 66207-056LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    0705430112

Molex Electronics Ltd.
Part No. 0705430112
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 8Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-807051000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430111

Molex Electronics Ltd.
Part No. 0705430111
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 7Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-705HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 5 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    0705430110

Molex Electronics Ltd.
Part No. 0705430110
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 6Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430108

Molex Electronics Ltd.
Part No. 0705430108
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 4Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430107

Molex Electronics Ltd.
Part No. 0705430107
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 66207-053LF
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    0705430119

Molex Electronics Ltd.
Part No. 0705430119
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 15Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.16K  /  4 Page

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Amphenol Communications Solutions

Part No. 69307-050LF
Description Crimp-to-Wire Housing, Double Row, 50 Position
Tech specs    

Official Product Page

    0705430120

Molex Electronics Ltd.
Part No. 0705430120
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 16 Circuits, 0.76um

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-429070500LF
Description BERGSTIK HDR DB SR TMT
Tech specs    

Official Product Page

For 500817-0705 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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