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wedge Datasheet PDF File

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				Marl International Limited Marl International Limi...
Part No.	207-993-21-38 207-993-23-38 207-930-21-38 207-501-21-38 207-521-21-38 207-532-23-38 207-521-23-38 207-501-21-38-15 207-501-21-38-1312 207-532-21-38
OCR Text	wedge base f9 ? ideal for industrial pushbutton switches and annunciator panels ? durable to shock and vibration ? ?fit and forget? reliability ? warm white leds may be used behind coloured lens as a true replacement for a filament lamp ? p...
Description	filament replacement leds Warm white LEDs
File Size	255.61K / 5 Page	View it Online	Download Datasheet

				SUNLED COMPANY LTD
Part No.	YWMDE101W14V
OCR Text	wedge based led published date : mar 26,2008 drawing no : sd sa6575 v1 checked : b.l.liu p.1/3 www.sunled.com notes: 1. all dimensions are in millimeters (inche...
Description	T-4 SINGLE COLOR LED, RED, 10 mm
File Size	150.87K / 3 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 Hittite Microwave Corporation
Part No.	HMC232
OCR Text	...P 7-7 Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 g...
Description	GaAs MMIC SPDT NON-REFLECTIVE SWITCH/ DC - 15.0 GHz GaAs MMIC SPDT NON-REFLECTIVE SWITCH, DC - 15.0 GHz
File Size	156.15K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC205
OCR Text	...edule. Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommende...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER, 6 - 12 GHz INPUT GaAs MMIC PASSIVE FREQUENCY DOUBLER 6 - 12 GHz INPUT
File Size	180.63K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55409
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of...
Description	GaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz
File Size	225.93K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55309
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of...
Description	GaAs MMIC FUNDAMENTAL MIXER, 7 - 14 GHz
File Size	215.97K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC34709
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire (dc bias, if1 and if2) or ribbon bond (rf and lo ports) 0.076 mm x 0.013 mm (3 mil x 0.5 mil) size is recommended. thermosonic wirebonding with a nomi...
Description	GaAs MMIC SPDT NON-REFLECTIVE SWITCH, DC - 20 GHz
File Size	213.57K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC48609
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams...
Description	GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 7 - 9 GHz
File Size	262.57K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC451
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 gr...
Description	GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5.0 - 20.0 GHz
File Size	343.24K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC44909
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 deg. c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 ...
Description	GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 27 - 33 GHz OUTPUT
File Size	239.51K / 6 Page	View it Online	Download Datasheet

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