Part Number Hot Search : 
MM3Z18VS I200A DDU222F A3035 24S12 P1010B M204S ISL628
Product Description
Full Text Search
  laminated Datasheet PDF File

For laminated Found Datasheets File :: 834    Search Time::3.234ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    POWEREX[Powerex Power Semiconductors]
Part No. PP450D120
OCR Text ...R-PAK includes a low inductance laminated bus structure, optically isolated gate drive interfaces, isolated gate drive power supplies, and a DC-link capacitor bank. The control board provides a simple user interface along with built-in prot...
Description POW-R-PAK 450A / 1200V Half Bridge IGBT Assembly

File Size 363.42K  /  6 Page

View it Online

Download Datasheet





    POWEREX[Powerex Power Semiconductors]
Part No. PP600D060
OCR Text ...R-PAK includes a low inductance laminated bus structure, optically isolated gate drive interfaces, isolated gate drive power supplies, and a DC-link capacitor bank. The control board provides a simple user interface along with built-in prot...
Description POW-R-PAK 600A / 600V Half Bridge IGBT Assembly

File Size 359.61K  /  6 Page

View it Online

Download Datasheet

    POWEREX[Powerex Power Semiconductors]
Part No. PP600D120
OCR Text ...R-PAK includes a low inductance laminated bus structure, optically isolated gate drive interfaces, isolated gate drive power supplies, and a DC-link capacitor bank. The control board provides a simple user interface along with built-in prot...
Description POW-R-PAK 600A / 1200V Half Bridge IGBT Assembly

File Size 362.78K  /  6 Page

View it Online

Download Datasheet

    Powerex Power Semicondu...
POWEREX[Powerex Power Semiconductors]
Powerex, Inc.
Part No. PP900D060
OCR Text ...R-PAK includes a low inductance laminated bus structure, optically isolated gate drive interfaces, isolated gate drive power supplies, and a DC-link capacitor bank. The control board provides a simple user interface along with built-in prot...
Description    POW-R-PAK 900A / 600V Half Bridge IGBT Assembly
POW-R-PAK 900A / 600V Half Bridge IGBT Assembly 的POW - r -巴基斯坦900A / 600V的IGBT的半桥大

File Size 362.31K  /  6 Page

View it Online

Download Datasheet

    Powerex, Inc.
POWEREX[Powerex Power Semiconductors]
Part No. PP900D120
OCR Text ...R-PAK includes a low inductance laminated bus structure, optically isolated gate drive interfaces, isolated gate drive power supplies, and a DC-link capacitor bank. The control board provides a simple user interface along with built-in prot...
Description POW-R-PAK 900A / 1200V Half Bridge IGBT Assembly 的POW - r -巴基斯坦900A / 1200伏半桥IGBT的大

File Size 362.79K  /  6 Page

View it Online

Download Datasheet

    Murata Manufacturing Co...
Part No. GRM31M5C2A473JA01
OCR Text ...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str...
Description Chip Multilayer Ceramic Capacitors for General Purpose

File Size 618.57K  /  30 Page

View it Online

Download Datasheet

    Murata Manufacturing Co...
Part No. GRM0335C1E6R8DA01
OCR Text ... material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm (grm02/grm03/grm15: t:0.8mm) copper foil thickness : 0.035mm : solder resist ...
Description Chip Monolithic Ceramic Capacitor for General

File Size 603.05K  /  30 Page

View it Online

Download Datasheet

    Murata Manufacturing Co...
Part No. GRM31M5C1H563JA01
OCR Text ...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str...
Description Chip Multilayer Ceramic Capacitors for General Purpose

File Size 618.57K  /  30 Page

View it Online

Download Datasheet

    Murata Manufacturing Co...
Part No. GRM0335C2A7R8DA01
OCR Text ... material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm (grm02/grm03/grm15: t:0.8mm) copper foil thickness : 0.035mm : solder resist ...
Description Chip Monolithic Ceramic Capacitor for General

File Size 603.04K  /  30 Page

View it Online

Download Datasheet

    Murata Manufacturing Co...
Part No. GRM31M5C1H473JA01
OCR Text ...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str...
Description Chip Multilayer Ceramic Capacitors for General Purpose

File Size 617.57K  /  30 Page

View it Online

Download Datasheet

For laminated Found Datasheets File :: 834    Search Time::3.234ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

▲Up To Search▲

 




Price and Availability




 
Price & Availability of laminated

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
1.1438820362091