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ST Microelectronics
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| Part No. |
EMIF02-MIC07F3
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| OCR Text |
...afer level packaging
Lead-free Flip-Chip package (8 bumps)
Complies with the following standards
IEC 61000-4-2 level 4 (on external pins B1 and C1) - + 15 kV (air discharge) - + 8 kV (contact discharge) IEC 61000-4-2 level 1 (on ex... |
| Description |
EMI filter and ESD protection
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| File Size |
345.88K /
7 Page |
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it Online |
Download Datasheet
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ST Microelectronics
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| Part No. |
DIP2450-01D3
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| OCR Text |
...e to optimize rf performance. flip chip package 4 bumps a b 1 2 2g 5g ant gnd www.st.com
characteristics dip2450-01d3 2/10 docid023193 rev 2 1 characteristics table 1. a bsolute rating (limiting values) symbol param... |
| Description |
2 G / 5 G WLAN diplexer
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| File Size |
252.82K /
10 Page |
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it Online |
Download Datasheet |
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Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
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| Part No. |
VESD05C-FC1
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| OCR Text |
Flip Chip Protection Diode - Chip Size 0402
Description
Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes... |
| Description |
Bidirectional ESD protection diodes
in flip-chip 1005 size;
Flip Chip Protection Diode - Chip Size 0402
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| File Size |
130.34K /
5 Page |
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it Online |
Download Datasheet |
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Price and Availability
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