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  70475-2181 Datasheet PDF File

For 70475-2181 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    14-45-1804 70475-0423 A-70475-0423

Molex Electronics Ltd.
Part No. 14-45-1804 70475-0423 A-70475-0423
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 4 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 4 Circuits

File Size 150.54K  /  3 Page

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Amphenol Communications Solutions

Part No. 70218-141LF
Description 4 Row Signal Header, Straight, Press-Fit
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    14-44-1613 70475-0782 A-70475-0782

Molex Electronics Ltd.
Part No. 14-44-1613 70475-0782 A-70475-0782
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 13 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 13 Circuits

File Size 148.30K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-810201900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-44-2918 A-70475-1312

Molex Electronics Ltd.
Part No. 14-44-2918 A-70475-1312
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 18 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 18 Circuits

File Size 141.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-816142500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-44-1614 A-70475-0783

Molex Electronics Ltd.
Part No. 14-44-1614 A-70475-0783
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 14 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 14 Circuits

File Size 149.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 10135218-101LF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 4-Pair, 10 column, 140 position, Right Angle Receptacle, No Guide Pin.
Tech specs    

Official Product Page

    A-70475-0251 14-45-0607

Molex Electronics Ltd.
Part No. A-70475-0251 14-45-0607
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 7 Circuits

File Size 143.83K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    14-44-5220 A-70475-2189

Molex Electronics Ltd.
Part No. 14-44-5220 A-70475-2189
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 20 Circuits

File Size 149.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    14-44-5219 A-70475-2188

Molex Electronics Ltd.
Part No. 14-44-5219 A-70475-2188
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 19 Circuits

File Size 141.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-8218-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    A-70475-0268 14-45-0624

Molex Electronics Ltd.
Part No. A-70475-0268 14-45-0624
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 24 Circuits

File Size 143.83K  /  2 Page

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Amphenol Communications Solutions

Part No. 70218-1104LF
Description 4 Row Signal Header, Straight, Press-Fit
Tech specs    

Official Product Page

    Musitech
Part No. GT2181
Description Power Audio Transistor

File Size 506.26K  /  4 Page

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Amphenol Communications Solutions

Part No. 70218-1119LF
Description 4 Row Signal Header, Straight, Press-Fit
Tech specs    

Official Product Page

    SQ2181

SeCoS Halbleitertechnologie GmbH
Part No. SQ2181
Description CMOS Positive Voltage Regula tor

File Size 1,380.61K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021814-09506T4LF
Description Minitek127®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

For 70475-2181 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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