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  3191-6P1-201 Datasheet PDF File

For 3191-6P1-201 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    SSM6P15FU

Toshiba Corporation
Toshiba Semiconductor
Part No. SSM6P15FU
Description Zener Diode; Application: Low noise; Pd (mW): 250; Vz (V): 4.9 to 5.3; Condition Iz at Vz (mA): 0.5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: DO-35
High Speed Switching Applications
File Size 176.38K  /  5 Page

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Amphenol Communications Solutions
Part No. 77319-103-72LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    SSM6P15FE

Toshiba Semiconductor
Part No. SSM6P15FE
Description High Speed Switching Applications
File Size 184.22K  /  5 Page

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Amphenol Communications Solutions
Part No. 77319-104-10LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    HHM1726P1-15

TDK Electronics
Part No. HHM1726P1-15
Description    Multilayer Balun
File Size 66.23K  /  6 Page

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Amphenol Communications Solutions
Part No. 10131931-919ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 19 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

    SONY
Part No. CXP826P16
Description CMOS 8-bit Single Chip Microcomputer
File Size 231.35K  /  21 Page

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Amphenol Communications Solutions
Part No. 77319-103-04LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 04 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    SWITCHCRAFT INC
Part No. 456P6P144
Description INTERCONNECTION DEVICE
File Size 1,007.72K  /  6 Page

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Amphenol Communications Solutions
Part No. 10131319-16221G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 16 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    SSM6P16FE

Toshiba Corporation
Toshiba Semiconductor
Part No. SSM6P16FE
Description Zener Diode; Application: Low noise; Pd (mW): 250; Vz (V): 2.2 to 2.6; Condition Iz at Vz (mA): 0.5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: DO-35
High Speed Switching Applications
File Size 179.14K  /  5 Page

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Amphenol Communications Solutions
Part No. 10131319-1221100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    SSM6P16FU

Toshiba Semiconductor
Part No. SSM6P16FU
Description High Speed Switching Applications
File Size 174.01K  /  5 Page

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Amphenol Communications Solutions
Part No. 10131319-10211G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    MES50A MES50A-0 MES50A-0R1B MES50A-1 MES50A-1-1 MES50A-1-1R1B MES50A-1R1B MES50A-2 MES50A-2P1J MES50A-3 MES50A-3P1J MES5

Mean Well Enterprises Co., Ltd.
Part No. MES50A MES50A-0 MES50A-0R1B MES50A-1 MES50A-1-1 MES50A-1-1R1B MES50A-1R1B MES50A-2 MES50A-2P1J MES50A-3 MES50A-3P1J MES50A-4 MES50A-4P1J MES50A-5 MES50A-5P1J MES50A-6 MES50A-6P1J MES50A-8 MES50A-8P1J
Description 24 ~ 50WAC-DC Single Output and Medical Type Desktop
File Size 230.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 77319-103-22LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    SEMELAB LTD
Part No. ALF16P16K
Description 16 A, 160 V, P-CHANNEL, Si, POWER, MOSFET, TO-3
File Size 630.93K  /  4 Page

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Amphenol Communications Solutions
Part No. 75188-319-18LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch.
Tech specs 　 　

Official Product Page

    CXP826P16

SONY[Sony Corporation]
Part No. CXP826P16
Description CMOS 8-bit Single Chip Microcomputer
File Size 241.74K  /  21 Page

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Amphenol Communications Solutions
Part No. 10131319-122110PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

For 3191-6P1-201 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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