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Analog Devices, Inc.
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| Part No. |
AD8139ACP-R2 AD8139ACPZ-R21 AD8139ARDZ-REEL AD8139ARD-REEL7 AD8139ACPZ-REEL
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| OCR Text |
...l t a g e a p plie d to one pi n . t h e i n te r n a l f e e d b a c k l o op a l s o prov i d e s out - s t an di n g o u t ...ex p o s e d p a dd le (ep) o n t h e u n d e rside o f i t s b o dy a n d a 3 m m 3 mm lfcs... |
| Description |
PTSE 11C 11#16 STR PLUG
Low Noise Rail-to-Rail Differential ADC Driver OP-AMP, 500 uV OFFSET-MAX, PDSO8
Low Noise Rail-to-Rail Differential ADC Driver OP-AMP, 500 uV OFFSET-MAX, DSO8
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| File Size |
525.66K /
24 Page |
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CUI
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| Part No. |
VIESD1-SXX
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| OCR Text |
...12 7 9 10 vin gn d + -v o 0v vo pi n pin function
rev . 06-2007 3 / 3 v -infinity , llc, 20050 sw 1 12th a ve., t ualatin, or 97062 ...ex ternal cap a citor v out ex ternal cap a citor 5v dc 4 . 7uf 5v dc 4.7uf 12v dc 2 .... |
| Description |
DC-DC Converter
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| File Size |
253.49K /
3 Page |
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it Online |
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Shenzhen Sunyuan
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| Part No. |
ISO4014
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| OCR Text |
...mark with config.connect config pi n to ground (g2 pin),then connect power supply,this time they are in listening mode.its set is as follows: address :00 baud rate 9600 bps checksum: disabled command ... |
| Description |
four-channel Data Acquisition Modules
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| File Size |
469.57K /
12 Page |
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it Online |
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意法半导
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| Part No. |
TS488 TS489
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| OCR Text |
...lter with c in (f c = 1 / (2 x pi x r in x c in )). c in1,2 input coupling capacitor that blocks the dc voltage at the amplifier?s input t...ex posing the ic to a short-circuit for an extended period of time will dramatically reduce the pr... |
| Description |
Pop-free 120mW stereo headphone amplifier
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| File Size |
459.89K /
32 Page |
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it Online |
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SAMSUNG SEMICONDUCTOR CO. LTD.
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| Part No. |
K4R271669E
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| OCR Text |
...s the following table shows the pi n assignments of the center- bonded rdram package. table 1: center-bonded csp device (top view) 7 dqa7 ...ex. this command provides a third mechanism for performing precharge.
page 6 direct rdram ? k... |
| Description |
128Mbit RDRAM(E-die)
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| File Size |
292.00K /
20 Page |
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it Online |
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SAMSUNG SEMICONDUCTOR CO. LTD.
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| Part No. |
K4R271669F
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| OCR Text |
...s the following table shows the pi n assignments of the center- bonded rdram package. table 1: center-bonded csp device (top view) 7 dqa7 ...ex. this command provides a third mechanism for performing precharge.
page 6 direct rdram ? k... |
| Description |
128Mbit RDRAM(F-die)
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| File Size |
293.32K /
20 Page |
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it Online |
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Intel Corp.
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| Part No. |
N8751H N8751H-8
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| OCR Text |
... t latch n i- ,,(-1 - - % = 2 w pi o*1 7 5 pm lhvi!rs ??????????? p] o-p3 7 7 w 3 i ????? ?.. j x = 272318-1 figure 1. mcsi@ 51 controller b...ex- tended temperature range with or without burn-in. with the commercial standard temperature range... |
| Description |
MCS51 8-BIT CONTROL-ORIENTED MICROCONTROLLERS
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| File Size |
717.87K /
21 Page |
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it Online |
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