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Motorola mobility Holdings, Inc.
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| Part No. |
MPC603EFE100LX MPC603EFE133LX MPC603EEC
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| Description |
MPC603e RISC Microprocessor Family PID6-603e Hardware Specification Advance Information
32-BIT, 133 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
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| File Size |
156.09K /
32 Page |
 View
it Online |
Download Datasheet
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Motorola mobility Holdings, Inc.
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| Part No. |
MPC603PFE220LX MPC603PFE240LX MPC603PFE233LX MPC603PFE180LX MPC603PFE200LX MPC603PFE166LX MPC603PFE160LX
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| Description |
32-BIT, 220 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 240 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 233 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 180 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 200 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 166 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 160 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
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| File Size |
165.40K /
40 Page |
View
it Online |
Download Datasheet |
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Motorola mobility Holdings, Inc.
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| Part No. |
3N204
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| Description |
300mA LDO Linear Regulators with Internal Microprocessor Reset Circuit 晶体管| MOSFET的| N沟道| 25V的五（巴西）直|0mA（丁）|2
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| File Size |
105.66K /
2 Page |
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it Online |
Download Datasheet |
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